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Methods and apparatus for processing a substrate

a technology for cleaning the edge and substrate, which is applied in the direction of edge grinding machines, grinding machines, manufacturing tools, etc., can solve the problems of abrasive film not being able to contact the edges sufficiently during cleaning, not thoroughly cleaning the edge, and abrasive film may become worn

Inactive Publication Date: 2009-02-05
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution effectively polishes both the outer edge and bevels of the substrate, reducing the need for frequent abrasive film replacement and improving manufacturing throughput by ensuring thorough cleaning and precise control over the edge polishing process.

Problems solved by technology

Conventional systems, which contact a substrate edge with an abrasive film to clean the edge, may not thoroughly clean the edge.
For example, the abrasive film may not sufficiently contact both bevels of the edge during cleaning.
Additionally, the abrasive film may become worn from use, and therefore, lose its ability to sufficiently clean the substrate and require frequent replacement, which may affect semiconductor device manufacturing throughput.

Method used

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  • Methods and apparatus for processing a substrate
  • Methods and apparatus for processing a substrate
  • Methods and apparatus for processing a substrate

Examples

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Embodiment Construction

[0023]The present invention provides improved methods and apparatus for cleaning and / or polishing the edge of a substrate. With reference to FIG. 1, a substrate 100 may include two major surfaces 102, 102′ and an edge 104. Each major surface 102, 102′ of the substrate 100 may include a device region 106, 106′ and an exclusion region 108, 108′. (Typically however, only one of the two major surfaces 102, 102′ will include a device region and an exclusion region.) The exclusion regions 108, 108′ may serve as buffers between the device regions 106, 106′ and the edge 104. The edge 104 of a substrate 100 may include an outer edge 110 and bevels 112, 114. The bevels 112, 114 may be located between the outer edge 110 and the exclusion regions 108, 108′ of the two major surfaces 102, 102′. The present invention is adapted to clean and / or polish the outer edge 110 and at least one bevel 112, 114 of a substrate 100 without affecting the device regions 106, 106′. In some embodiments, all or par...

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Abstract

A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.

Description

[0001]This application is a division of, and claims priority to, U.S. Non-Provisional patent application Ser. No. 11 / 299,295, filed Dec. 9, 2005, and titled, “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10121), which is hereby incorporated by reference herein in its entirety for all purposes.CROSS-REFERENCE TO RELATED APPLICATIONS[0002]The present invention is related to U.S. patent application Ser. No. 11 / 298,555 filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10414) which is hereby incorporated herein by reference for all purposes.FIELD OF THE INVENTION[0003]The present invention relates generally to substrate processing, and more particularly to methods and apparatus for cleaning an edge of a substrate.BACKGROUND[0004]Conventional systems, which contact a substrate edge with an abrasive film to clean the edge, may not thoroughly clean the edge. For example, the abrasive film may not sufficiently...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B1/04B24B9/00
CPCB24B1/04B24B9/065H01L21/02021C03C19/00B24B21/004
Inventor WASINGER, ERIK C.ETTINGER, GARY C.KO, SEN-HOUHSU, WEI-YUNGCHEN, LIANG-YUHSHIN, HO SEONOLGADO, DONALD
Owner APPLIED MATERIALS INC