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Packing box

a technology for packaging boxes and boxes, applied in the field of packaging boxes, can solve the problems of complex shock absorption materials and high cos

Inactive Publication Date: 2011-09-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shock absorbing material is complicated and costly.

Method used

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Examples

Experimental program
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Embodiment Construction

[0012]FIG. 1 is one embodiment of a structure of cardboard material 88. The cardboard material 88 includes a front side board 110, a rear side board 120, a left side board 130, and a right side board 140. A front bottom board 150, a rear bottom board 160, a front top board 170, a rear top board 180, a second buffer board 190, a fourth buffer board 200, a first buffer board 210, a third buffer board 220, and a fixed board 230 are also included.

[0013]The rear side board 120, the left side board 130, the front side board 110, and the right side board 140 are rectangular. The rear side board 120, the left side board 130, the front side board 110, the right side board 140, and the fixed board 230 connect to each other in sequence. A folding line 11 is defined between the rear side board 120 and the left side board 130. A folding line 12 is defined between the left side board 130 and the front side board 110. A folding line 13 is defined between the front side board 110 and the right side...

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PUM

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Abstract

A packing box configured to pack an object and includes a body, a first buffer part, a second buffer part, a third buffer part, and a fourth buffer part. The first buffer part and the third buffer part are located at the bottom of the body. The second buffer part and the fourth buffer part are located at the top of the body. The body, the first buffer part, the second buffer part, the third buffer part, and the fourth buffer part are integrated. The object may be located between the first buffer part, the second buffer part, the third buffer part, and the fourth buffer part.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to packing boxes or shipping boxes.[0003]2. Description of Related Art[0004]Most packing boxes for packing electronic products are provided with shock absorbing material to prevent the electronic products from being damaged. Such shock absorbing materials secure an electronic device in a packing box with a fastening mechanism and fill the packing box to surround the electronic device. The shock absorbing material is complicated and costly.[0005]Therefore, there is room for improvement within the art.BRIEF DESCRIPTION OF THE DRAWINGS[0006]Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the various drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the fig...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B65D81/02
CPCB65D5/2009B65D5/5009B65D5/48048
Inventor YE, SHENGLUO, MING-MING
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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