Polyamide composite structures and processes for their preparation
a composite structure and polyamide technology, applied in the field of polyamide composite structures, can solve the problems of reduced mechanical properties, poor appearance and function of the surface of the overmolded polymer and the surface of the component comprising the fibrous material, and poor adhesion between the overmolded polymer and the surface of the component, etc., to achieve good mechanical properties, easy processing, and good flexural strength.
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examples
[0054]The following materials were used for preparing the composites structures according to the present invention and comparative examples.
[0055]Materials
[0056]The materials below are comprised in the compositions used in the Examples and Comparative Examples.
[0057]Polyamide from group II (B)(PA1 in Tables 1 and 2): a group II polyamide made of adipic acid and 1,6-hexamethylenediamine with a weight average molecular weight of around 32000 Daltons. PA1 has a melting point of about 260° C. to about 265° C. and a glass transition of about 40° C. to about 70° C. PA1 is called PA6,6 and is commercially available, for example, from E. I. du Pont de Nemours and Company.
[0058]Polyamide from group I (A) (PA2 in Tables 1 and 2): a group I polyamide made of ε-caprolactam having a melting point of about 220° C. PA2 is called PA6 and is commercially available, for example, from BASF corporation.
Preparation of Films
[0059]The resin compositions used in the Examples (abbreviated as “E” in Tables 1...
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Abstract
Description
Claims
Application Information
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