Flexible substrate

a flexible substrate and substrate technology, applied in the direction of electric apparatus casings/cabinets/drawers, casings with display/control units, transportation and packaging, etc., can solve the problems of glass substrates prone to cracking in the production process of fpd, insufficient impact resistance, and insufficient gas barrier properties of resin films, etc., to achieve excellent gas barrier properties, excellent flexibility and gas barrier properties

Inactive Publication Date: 2016-04-28
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a flexible substrate with excellent flexibility and gas barrier properties. It has a central inorganic glass layer that acts as a gas barrier layer, and resin layers and an inorganic thin film that block the penetration of gas or moisture. The inorganic glass also prevents the thermal expansion of the resin layers and provides a small coefficient of linear expansion. Resin layers on both sides of the inorganic glass alleviate stress and allow for the thinning and weight reduction of the inorganic glass. This flexible substrate has high operability and is suitable for use in organic electroluminescence display apparatuses.

Problems solved by technology

However, when one attempts to perform the thinning of any such glass substrate for imparting flexibility to the glass substrate, impact resistance becomes insufficient, and hence, for example, the following problem arises.
That is, the glass substrate is apt to crack in a production process for an FPD.
However, none of the resin films can provide sufficient gas barrier properties (such as oxygen-blocking property and water vapor-blocking property) requested of a substrate for an FPD alone.
However, the gas barrier properties of the laminate material of Patent Document 1 are still not enough for the laminate material to be used in an organic electroluminescence display apparatus of which high gas barrier properties are requested out of the FPDs.

Method used

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Examples

Experimental program
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Effect test

example 1

Production of Base Material (Resin Layer / Inorganic Glass / Resin Layer)

[0101]A plate-like inorganic glass having a thickness of 50 μm (“D263” manufactured by SCHOTT AG) was washed with methyl ethyl ketone (MEK), and both of its surfaces were subjected to a corona treatment. After that, a silane coupling agent (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to each of both surfaces of the inorganic glass, and then the resultant was heat-treated at 110° C. for 5 minutes.

[0102]Next, a mixed liquid of an epoxy resin 1 represented by the following formula (a) (Celoxide 2021P manufactured by Daicel Chemical Industries Limited), an epoxy resin 2 (a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, manufactured by Daicel Chemical Industries Limited., EHPE3150), an oxetane resin represented by the following formula (5) (OXT221 manufactured by Toagosei Company, Limited), and a polymerization initiator (SP-170 manufactured by ADEKA CORPORATION) wa...

example 2

[0111]A flexible substrate was produced in the same manner as in Example 1 except that an SiO, film (having a thickness of 100 nm) was formed on one surface of the base material by a plasma CVD method. Conditions for the formation of the SiO film are as described below.

[0112]Degree of vacuum: 0.3 Pa (2.25×10−3 Torr)

[0113]SiH4 gas flow rate: 10 sccm

[0114]Oxygen gas flow rate: 20 sccm

[0115]Nitrogen gas flow rate: 50 sccm

[0116]Frequency: 13.56 MHz

[0117]Electric power: 500 W

example 3

[0118]A flexible substrate was produced in the same manner as in Example 1 except that a diamond-like carbon (DLC) film (having a thickness of 100 nm) was formed on one surface of the base material by a plasma CVD method. Conditions for the formation of the DLC film are as described below.

[0119]Degree of vacuum: 0.3 Pa (2.25×10−3 Torr)

[0120]CH4 gas flow rate: 200 sccm

[0121]Frequency: 13.56 MHz

[0122]Electric power: 1000 W

[0123]Electrode DC voltage: 300 V

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Abstract

There is provided a flexible substrate having excellent flexibility and gas barrier properties. A flexible substrate 100 according to the present invention includes: a base material 20 including an inorganic glass 10 and resin layers 11 and 11′ placed on both sides of the inorganic glass 10; and an inorganic thin film 12 placed on a side of one of the resin layers where the inorganic glass is not placed, wherein the inorganic thin film 12 is formed on at least a peripheral edge of one surface of the base material.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a divisional application of U.S. patent application Ser. No. 12 / 988,764, filed Nov. 3, 2010, which is a National Stage Entry of PCT / JP2009 / 057737, filed Apr. 17, 2009; claiming priority to Japanese Patent Application No. 2008-114372, filed Apr. 24, 2008, the entire contents is herein incorporated by reference.TECHNICAL FIELD[0002]The present invention relates to a flexible substrate, and more specifically, to a flexible substrate having excellent gas barrier properties.BACKGROUND ART[0003]In association with the development of an image communication technology, the thinning of flat panel displays (FPDs) has been advanced in recent years. A substrate that brings together flexibility and impact resistance will be indispensable for the realization of a curved surface display of a large panel seeking for a high realistic sensation and an improvement in flexibility of a take-up type portable terminal or the like pursuing po...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H05K1/03H05K1/11H05K5/00H01L51/00H10K99/00
CPCH05K1/0353H01L51/0097H05K5/0017H05K1/0306H05K1/11Y02E10/549Y10T428/266Y10T428/31645B32B17/10H10K77/111H10K2102/311H10K59/8731H10K50/844H10K50/84H10K50/8445
InventorMURASHIGE, TAKESHIYAMAOKA, TAKASHIHATTORI, DAISUKESAKATA, YOSHIMASANAGATSUKA, TATSUKI
OwnerNITTO DENKO CORP