Transformational architecture for multi-layer systems

Abstract

The new architecture disclosed herein exploits advances in system and chip technologies to implement a scalable multi-port open network. Using System-on-a-Chip (SOCs) and / or Multi-Chip-Module (MCM) technology, the architecture is implemented to efficiently handle multi-port switching. The novelty lies in using multi-core computing model in the data, control and management planes of multi-port networking cards implemented as an elemental scalable system (ESS) comprising N number of Elemental Units (EUs). EUs comprise device arrays on an integrated circuit (IC) platform using integrated silicon photonics or discrete electro-optics. TX4M™ system architecture therefore includes multiple EUs, switch fabric, multi-core central processing unit (CPU), multi-port power management module with embedded programmable logic, a back plane interface (BPI) as well as selectable functions for front plane interface (FPI) implemented in FPGAs for integration of front plane interface optics on host or on pluggable modules.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of U.S. patent application Ser. No. 14 / 726,262 filed May 29, 2015, which claims the benefit of U.S. Provisional Patent Application Ser. No. 62 / 004,726, filed May 29, 2014, the disclosures of which are hereby incorporated by reference in their entirety.FIELD OF THE DISCLOSURE[0002]This disclosure relates to an improved and condensed architecture for multi-layer open networks. Applications include data communication and telecommunication network applications, as well as consumer and defense applications. Particular application includes access, aggregation and core multi-tier design for data centers. Specifically, this disclosure addresses how system cards are architected and partitioned at the lower layers of the communication protocol for multi-port datacom, telecom, cloud computing networks, and other computer networks for consumer and defense applications.BACKGROUND OF THE RELATED ART[0003]Multi-layer o...

AI Technical Summary

Benefits of technology

[0007]The new architecture disclosed herein (code-named TX4M™ Architecture being developed by Optel Networks based in San Jose, Calif.) leverages advances in system and chip technologies to implement an elemental scalable system (ESS) between the front plane and the back plane interfaces, built for handling open network protocols. Using System-on-a-Chip (SOCs) and / or Multi-Chip-Module (MCM) technology, the architecture is implemented to efficiently handle multi-port network switching. The concept is similar to multi-core processors for computing. The novelty lies in using multi-core computing in the data, control and management planes of multi-port networking cards, implemented as integrated circuit (IC) on a PCB. By condensing more and more network functionalities into ICs and vertical integration of modules, this architecture eliminates many PCB layers without compromising port configurability and partitioning functionalities. Integration of optics and electronics on a single substrate enables signal conditioning, routing, switching and bandwidth provisioning at low power in a scalable manner.

Problems solved by technology

But this component supply and manufacturing ecosystem forced the industry to adopt only certain types of partitioning design with discrete components and external interfaces.

In a multi-layer printed circuit board (PCB) embodiment of a network card, transmission lines between the PCB layers lead to significant amount of power dissipation.

High density nature of the PCBs with numerous ports operating at 10 Gb / s and beyond leads to dense and longer trace lengths adding significant routing complexity and power dissipation.

The routing complexity is the leading cause of increase in layer count in the PCBs.

This leads to enormous board complexity impacting manufacturing yields and quality and / or reliability of the systems.

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