Low-temperature curing conductive silver paste for electronic packaging and preparation method thereof

Abstract

The invention relates to a low-temperature curing conductive silver paste for electronic packaging and a preparation method thereof. The low-temperature curing conductive silver paste for electronic packaging comprises the following components in parts by weight: 8-20 parts of high-temperature-resistant epoxy resin, 2-5 parts of high-temperature-resistant curing agent, 5-10 parts of diluent, 0.5-1.5 parts of coupling agent, 10-20 parts of power fillers and 70-80 parts of conductive silver power. The low-temperature curing conductive silver paste has the characteristics of low curing temperature, high temperature resistance, high thermal conductivity and high bonding and can significantly improve the reliability of packaging devices and is especially suitable for bonding and heat dissipation of third generation wide band gap semiconductor chips.

Description

technical field

[0001] The invention relates to electronic packaging materials, in particular to a low-temperature curing conductive silver paste for electronic packaging and a preparation method thereof. Background technique

[0002] The third-generation wide-bandgap semiconductor materials represented by silicon carbide, gallium nitride and zinc oxide have large bandgap width, high breakdown field strength, high thermal conductivity, high electron saturation drift speed, and small dielectric constant. , strong radiation resistance, good chemical stability and other characteristics, can realize high voltage, high temperature, high frequency, high power, radiation resistant microwave millimeter wave devices and short wavelength optoelectronic semiconductor devices, is the "solid-state light source and power electronics, microwave radio frequency devices" Core" has broad application prospects in semiconductor lighting, 5G communications, smart grid, expressway transportation,...

Examples

preparation example Construction

[0033] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic packaging comprises the following steps:

[0034] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for 8-10h, and cool to room temperature;

[0035] (2) Put the uniformly dissolved resin, diluent, high temperature resistant curing agent, coupling agent, and powder filler in step (1) into the stirring device for mixing, and put the mixed materials into the grinder for Grinding until the fineness is reduced to below 5 μm;

[0036] (3) Add the conductive silver powder to the ground material in step (2), repeat the steps of mixing and grinding in step (2), and grind to a fineness below 15um to obtain a low-temperature curing conductive silver paste for electronic packaging.

Embodiment 1

[0039] A low-temperature curing conductive silver paste for electronic packaging, comprising the following components in parts by weight: 8 parts of high-temperature-resistant epoxy resin, 2 parts of high-temperature-resistant curing agent, 10 parts of powder filler, 5 parts of diluent, and 0.5 parts of coupling agent part, 70 parts of conductive silver powder. Among them, high temperature resistant epoxy resin is JD939, high temperature resistant curing agent is SH-200, powder filler is aluminum nitride powder, diluent is 2-cresyl glycidyl ether, coupling agent is KH-550, conductive silver powder particles The diameter is 0.5-2μm, and the tap density is 4-6g / cm3.

[0040] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic packaging comprises the following steps:

[0041] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for 8-10h, and cool to room temperature;

[0042...

Embodiment 2

[0046] A low-temperature curing conductive silver paste for electronic material packaging, comprising the following components: in parts by weight, 11 parts of high-temperature-resistant epoxy resin, 3 parts of high-temperature-resistant curing agent, 15 parts of powder filler, 7 parts of diluent, 0.5 parts of coupling agent, 70 parts of conductive silver powder. Among them, the high temperature resistant epoxy resin is AFG90, the high temperature resistant curing agent is 4,4-diaminodiphenyl sulfone, the powder filler is nano-alumina, the diluent is phenyl glycidyl ether, and the coupling agent is KH-560. The particle size of the conductive silver powder is 0.5-2μm, and the tap density is 4-6g / cm3.

[0047] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic material packaging comprises the following steps:

[0048] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for ...

technical field

[0001] The invention relates to electronic packaging materials, in particular to a low-temperature curing conductive silver paste for electronic packaging and a preparation method thereof. Background technique

[0002] The third-generation wide-bandgap semiconductor materials represented by silicon carbide, gallium nitride and zinc oxide have large bandgap width, high breakdown field strength, high thermal conductivity, high electron saturation drift speed, and small dielectric constant. , strong radiation resistance, good chemical stability and other characteristics, can realize high voltage, high temperature, high frequency, high power, radiation resistant microwave millimeter wave devices and short wavelength optoelectronic semiconductor devices, is the "solid-state light source and power electronics, microwave radio frequency devices" Core" has broad application prospects in semiconductor lighting, 5G communications, smart grid, expressway transportation,...

Examples

preparation example Construction

[0033] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic packaging comprises the following steps:

[0034] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for 8-10h, and cool to room temperature;

[0035] (2) Put the uniformly dissolved resin, diluent, high temperature resistant curing agent, coupling agent, and powder filler in step (1) into the stirring device for mixing, and put the mixed materials into the grinder for Grinding until the fineness is reduced to below 5 μm;

[0036] (3) Add the conductive silver powder to the ground material in step (2), repeat the steps of mixing and grinding in step (2), and grind to a fineness below 15um to obtain a low-temperature curing conductive silver paste for electronic packaging.

Embodiment 1

[0039] A low-temperature curing conductive silver paste for electronic packaging, comprising the following components in parts by weight: 8 parts of high-temperature-resistant epoxy resin, 2 parts of high-temperature-resistant curing agent, 10 parts of powder filler, 5 parts of diluent, and 0.5 parts of coupling agent part, 70 parts of conductive silver powder. Among them, high temperature resistant epoxy resin is JD939, high temperature resistant curing agent is SH-200, powder filler is aluminum nitride powder, diluent is 2-cresyl glycidyl ether, coupling agent is KH-550, conductive silver powder particles The diameter is 0.5-2μm, and the tap density is 4-6g / cm3.

[0040] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic packaging comprises the following steps:

[0041] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for 8-10h, and cool to room temperature;

[0042...

Embodiment 2

[0046] A low-temperature curing conductive silver paste for electronic material packaging, comprising the following components: in parts by weight, 11 parts of high-temperature-resistant epoxy resin, 3 parts of high-temperature-resistant curing agent, 15 parts of powder filler, 7 parts of diluent, 0.5 parts of coupling agent, 70 parts of conductive silver powder. Among them, the high temperature resistant epoxy resin is AFG90, the high temperature resistant curing agent is 4,4-diaminodiphenyl sulfone, the powder filler is nano-alumina, the diluent is phenyl glycidyl ether, and the coupling agent is KH-560. The particle size of the conductive silver powder is 0.5-2μm, and the tap density is 4-6g / cm3.

[0047] The preparation method of the above-mentioned low-temperature curing conductive silver paste for electronic material packaging comprises the following steps:

[0048] (1) Stir and dissolve the high temperature resistant resin and diluent at a temperature of 20°C-50°C for ...