Organic metal solderability preservative and preparation method and application oforganic metal solderability preservative film

Abstract

The invention belongs to the technical field of circuit board processing, and particularly relates to an organic metal solderability preservative and a preparation method and application of an organic metal solderability preservative film. The organic metal solderability preservative provided by the invention is prepared from thiazole derivatives, imidazole derivatives, azole derivatives, secondary alkyl sodium sulfate, malic acid, tartaric acid, ethanol and water. The pH regulator is added into the formula of the organic metal solderability preservative provided by the invention, so that the processing of a PCB cannot be influenced by the change of the concentration and pH of the organic metal solderability preservative, and the service life of the organic solderability preservative cannot be shortened; and the organic metal solderability preservative film prepared by using the organic metal solderability preservative provided by the invention has the advantages of no blackening of the film surface, no influence on the welding performance of metal, no galvanic effect, and good oxidation resistance, thermal shock resistance and moisture resistance.

Description

technical field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a preparation method and application of an organic metal soldering flux and an organic metal soldering film. Background technique

[0002] Organic solder protection film (OSP) is also called copper protectant. Simply put, OSP is to chemically grow a layer of organic film on the clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) The clean copper surface can be immediately combined with molten solder to form a strong solder joint in a very short time.

[0003] At present, the printed circuit board (PCB) industry generally adopts organic solder protection film, chemical nickel gold, chemical tin, chemical silver and other surface treatment processes for bare copper protection, among which the use of organic sol...

Examples

Embodiment 1

[0030] Embodiment 1, a kind of preparation method of organometallic solder protection flux and organometallic solder protection film

[0031] The organic metal flux includes the following components and parts by weight thereof:

[0032] 20 parts of thiazole derivatives, 10 parts of imidazole derivatives, 8 parts of nitrogen azole derivatives, 5 parts of sodium secondary alkyl sulfate, 28 parts of malic acid, 20 parts of tartaric acid, 10 parts of ethanol, and 150 parts of water.

[0033] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 13:2.

[0034] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 7:11:4.

[0035] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazol...

Embodiment 2

[0044] Embodiment 2, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0045] The organic metal flux includes the following components and parts by weight thereof:

[0046] 30 parts of thiazole derivatives, 15 parts of imidazole derivatives, 13 parts of nitrogen azole derivatives, 8 parts of sodium secondary alkyl sulfate, 35 parts of malic acid, 30 parts of tartaric acid, 15 parts of ethanol, and 200 parts of water.

[0047] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 15:4.

[0048] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 3:9:2.

[0049] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazole ...

Embodiment 3

[0058] Embodiment 3, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0059] The organometallic flux includes the following components and parts by weight: 26 parts of thiazole derivatives, 12 parts of imidazole derivatives, 11 parts of nitrogen azole derivatives, 6.3 parts of secondary alkyl sodium sulfate, 27 parts of malic acid 24.5 parts of tartaric acid, 12.6 parts of ethanol, and 178 parts of water.

[0060] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 14:3.

[0061] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 5:10:3.

[0062] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazoles are compo...

technical field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a preparation method and application of an organic metal soldering flux and an organic metal soldering film. Background technique

[0002] Organic solder protection film (OSP) is also called copper protectant. Simply put, OSP is to chemically grow a layer of organic film on the clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) The clean copper surface can be immediately combined with molten solder to form a strong solder joint in a very short time.

[0003] At present, the printed circuit board (PCB) industry generally adopts organic solder protection film, chemical nickel gold, chemical tin, chemical silver and other surface treatment processes for bare copper protection, among which the use of organic sol...

Examples

Embodiment 1

[0030] Embodiment 1, a kind of preparation method of organometallic solder protection flux and organometallic solder protection film

[0031] The organic metal flux includes the following components and parts by weight thereof:

[0032] 20 parts of thiazole derivatives, 10 parts of imidazole derivatives, 8 parts of nitrogen azole derivatives, 5 parts of sodium secondary alkyl sulfate, 28 parts of malic acid, 20 parts of tartaric acid, 10 parts of ethanol, and 150 parts of water.

[0033] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 13:2.

[0034] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 7:11:4.

[0035] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazol...

Embodiment 2

[0044] Embodiment 2, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0045] The organic metal flux includes the following components and parts by weight thereof:

[0046] 30 parts of thiazole derivatives, 15 parts of imidazole derivatives, 13 parts of nitrogen azole derivatives, 8 parts of sodium secondary alkyl sulfate, 35 parts of malic acid, 30 parts of tartaric acid, 15 parts of ethanol, and 200 parts of water.

[0047] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 15:4.

[0048] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 3:9:2.

[0049] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazole ...

Embodiment 3

[0058] Embodiment 3, a kind of preparation method of organic metal solder protection flux and organic metal solder protection film

[0059] The organometallic flux includes the following components and parts by weight: 26 parts of thiazole derivatives, 12 parts of imidazole derivatives, 11 parts of nitrogen azole derivatives, 6.3 parts of secondary alkyl sodium sulfate, 27 parts of malic acid 24.5 parts of tartaric acid, 12.6 parts of ethanol, and 178 parts of water.

[0060] The thiazole derivatives in the organometallic flux are composed of aryl-substituted thiazole and 5-benzylthio-1,3,4-thiadiazole-2-thiol in a mass ratio of 14:3.

[0061] The imidazole derivatives in the organometallic flux are composed of 2-hydroxybenzimidazole, 1-(4-aminophenyl)imidazole and N-acetylimidazole in a mass ratio of 5:10:3.

[0062] The azole derivatives in the organometallic flux are composed of tolyltriazole, 4,5-dibromo-1H-benzotriazole and 5-amino-3-mercapto-1,2,4 - Triazoles are compo...

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