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Semiconductor resin vibration powdering device

This invention belongs to the field of semiconductor equipment technology and provides a semiconductor resin vibration powder dispensing device, including a powder dispensing mechanism, a vibration mechanism, and a support mechanism. The vibration mechanism includes a connecting seat for mounting the powder dispensing mechanism, a vibrator fixedly connected to the connecting seat, a protective cover located on the side of the vibrator away from the connecting seat and elastically connected to the vibrator, a weighing sensor installed inside the protective cover for acquiring the weight information of the material within the powder dispensing mechanism, and a mounting base fixedly connected to the end of the protective cover away from the vibrator and to the support mechanism at the end opposite to the vibrator. The powder dispensing mechanism and the vibration mechanism of this invention cooperate, utilizing the vibration generated by the vibrator to act on the powder dispensing mechanism, causing the resin powder to be evenly spread and stably conveyed under vibration, avoiding local accumulation or gaps, thereby ensuring uniform distribution of resin on the mold surface, significantly improving the consistency of the molded body thickness, and reducing molding defects caused by uneven powder dispensing.
Owner:ANHUI ZHONGHE SEMICON TECH CO LTD