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Package structure of power power-supply module

A technology of module packaging and power supply, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of poor heat dissipation, packaging structure circuit density and heat dissipation efficiency, and circuit density cannot be improved.

Active Publication Date: 2009-01-28
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the problem of poor circuit density and heat dissipation efficiency of the packaging structure in the above technical background, the present invention discloses a packaging structure in which the circuit is fabricated on the circuit board and formed into a stacked structure with the lead frame, and the power supply element has a good heat conduction path , so as to improve the problems of poor heat dissipation and circuit density that cannot be improved due to poor packaging structure in the known technology

Method used

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  • Package structure of power power-supply module
  • Package structure of power power-supply module
  • Package structure of power power-supply module

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Embodiment Construction

[0035]Please refer to FIG. 4A , which is a schematic cross-sectional view of a package structure of a power supply module according to an embodiment of the present invention. The packaging structure includes a substrate 400 with high heat dissipation and insulation properties, and the substrate 400 has a front surface 400a and a back surface 400b corresponding to the front surface. A lead frame 420 with a plurality of pins 421 , 422 . A circuit plate (circuitplate) 425 is arranged on the first surface 420a of the lead frame 420 with its two ends connected to form a stacked structure arranged on the substrate 400, so the required substrate area can be reduced, and the packaging structure can be reduced. volume. In addition, there is a second element 410b (in other embodiments, there may be several) and a plurality of first elements 410a are respectively arranged on the circuit board 425 and the first surface 420a of the lead frame 420, and are connected by wire bonding. Sever...

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Abstract

The packaging structure fabricates control circuit on a circuit board instead of base plate so as to reduce appropriative area of base plate, and save manufacturing cost. In addition, power components are setup in material with high heat transmission. Thus, heat generated from power components are transferred and emitted quickly. The invention raises reliability of power module.

Description

technical field [0001] The present invention relates to a packaging structure of a power supply module, in particular to a packaging structure of a power supply module featuring high heat dissipation and high density. Background technique [0002] The reduction in size and the increasing complexity of design are the common trends of various electronic products. Therefore, in addition to the reduction in the size of electronic components, how to arrange the most components and leads in a limited space has become an important issue in semiconductor packaging. However, under the package structure with higher and higher density of components and leads, the high-density components driving the package structure will generate a lot of heat. Especially for power modules, this large amount of heat will affect the life and operation of electronic products. Therefore, how to solve the heat dissipation problem of this high-density packaging structure has also become an important issue....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/34
CPCH01L2224/48247H01L2924/19107H01L2924/181H01L2924/00012
Inventor 刘春条陈大容林俊良李正人徐振杰温兆均
Owner CYNTEC