Photoelectric encoder
An encoder, photoelectric technology, applied in the direction of instruments, conversion sensor output, measurement devices, etc., can solve the problem of low response rate of the encoder that cannot be ignored, and achieve the effect of suppressing the increase of the number and preventing the increase of the junction capacitance.
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no. 1 Embodiment approach
[0049] figure 1 It is a figure which shows the schematic structure of the photoelectric encoder 1 of 1st Embodiment. The present embodiment is mainly characterized by the structure of a photodetector chip included in the light receiving portion, and the photoelectric encoder 1 will be described as a premise for understanding thereof. First, the configuration of the encoder 1 will be described. The encoder 1 is composed of a light emitting diode (LED (light emitting diode)) 3, a scale 5 and a light receiving unit 7 arranged in the order close to the light emitting diode (LED).
[0050] The light emitting diode 3 is an example of a light source, and irradiates the scale 5 with the light L from the diode 3 . The scale 5 includes an elongated transparent substrate 9 made of a transparent material such as glass. exist figure 1 , indicating a part of it. The optical lattice 11 is formed on the surface of the transparent substrate 9 on the opposite side to the surface facing t...
no. 2 Embodiment approach
[0073] The second embodiment will be described focusing on the differences from the first embodiment. Figure 7 This is a plan view schematically showing the arrangement relationship between one light receiving surface and the calibration grid 33 in the central portion 29 of the PD array formed on the light receiving chip 15 of the photoelectric encoder according to the second embodiment. Figure 8 is observed from the VIII(a)-VIII(b) section Figure 7 A plan view of the structure shown.
[0074] In the second embodiment, the light shielding portion 35 of the calibration grid 33 is a part of the wiring connected to the photodiode 23 . It will be described in detail below. The light shielding portion 35 is made of conductive metal such as aluminum. The four light shielding portions 35 and the wirings 47 arranged on the light receiving surface 25 are located in the same layer. They are formed by simultaneous patterning. The two light-shielding portions 35-1 in the center of...
no. 3 Embodiment approach
[0079] The third embodiment will be described focusing on the differences from the first embodiment. Figure 9 It is a plan view schematically showing the photodiode array of the light receiving chip 15 of the third embodiment viewed from the optical lattice side. In this figure, the illustration of the calibration grid is omitted. Figure 10 It is a partial plan view of the light receiving chip 15 of the third embodiment. In this figure, the positional relationship between the light receiving surface 25 and the light transmitting portion 40 of the calibration grid is shown. The lattice arranged in front of the light receiving element is called a calibration lattice.
[0080] like Figure 9 As shown, the light-receiving surfaces 25 of the plurality of PDs 23 are arranged in two dimensions on the xy planes facing each other with the optical lattice. In other words, the plurality of PDs 23 are arranged in an array. It can also be said that the plurality of PDs 23 are arrang...
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