Advanced sandwich sub card test general carrier plate and its production method

Abstract

The invention discloses a general-purpose carrier board for testing advanced mezzanine sub-cards and a manufacturing method thereof. The carrier board is provided with a standard sub-card socket for fixing the advanced mezzanine sub-card in a positive insertion state, and for testing the advanced mezzanine sub-card. The carrier board is also equipped with a mirror image daughter card socket, which is used to fix the advanced mezzanine daughter card in the reverse insertion state; the manufacturing method of the mirror image daughter card socket: A. A sub-card socket for fixing the advanced mezzanine sub-card is arranged on the board; B. modify the pin definition of the sub-card socket, so that each signal provided by the carrier board is respectively sent to the counter through the modified sub-card socket; Inserted into the advanced mezzanine daughter card. The invention can test the reverse side of the daughter card, thereby realizing the comprehensive test of the signal integrity of the AMC daughter card.

Description

Technical field [0001] The invention relates to the testing field of signal integrity and functions of AMC (Advanced Mezzanine Card) daughter cards, and in particular to a universal carrier board for providing AMC daughter card mirror slot testing and a manufacturing method. Background technique [0002] Nowadays, the frequency of communication systems is getting higher and higher, and the requirements for circuits are also increasing. The correctness and functional stability of high-frequency circuits not only depend on the correctness of the circuit principle, but also largely by the signal integrity of high-speed signals. Sexual decision. Therefore, the test of the current high-speed communication single board not only needs to verify its function, but also needs to conduct a comprehensive and carpet-like investigation of signal integrity in order to find possible problems and find solutions. [0003] Signal integrity SI (signal integrity) is defined as: the ability of a trans...

AI Technical Summary

Problems solved by technology

[0011] The above method of hollowing out the PCB below the AMC daughter card, although the reverse side of the carrier board can be turned over to test the daughter card, has three main disadvantages: first, hollowing out the carrier board PCB brings difficulties to the layout and wiring of the carrier board, If the test carrier board is complex, the wiring area may not be enough

Second, hollowing out the PCB carrier board, splitting the power and ground planes, deteriorating the power integrity of the carrier board, and then affecting the signal integrity and EMI (Electro Magnetic Interference, Electromagnetic Interference) of the carrier board high-speed signal, EMC (Electro Magnetic Compatibility, electromagnetic compatibility), etc., this is only important

In addition, hollowing out the PCB board under the AMC daughter card will affect the contact performance of the daughter card connector when fixing the daughter card and reversing the carrier board.

[0012] The method of extending the socket of the daughter card mentioned above is to insert an extension board into the AMC socket to extend the interface signal of the daughter card to the outside of the machine frame, provide an AMC socket outside the machine frame, and insert the AMC daughter card into the extended daughter card socket for testing. Although this method can also test the back of the daughter card, it is very inconvenient to use, and it is not convenient to test the touch signal with an oscilloscope; in addition, the test extension cable has a great impact on the signal integrity of the daughter card interface signal, which is not conducive to accurate testing of signal waveforms

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