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Heat radiator

A technology of heat dissipation device and heat dissipation plate, applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, can solve the problems of inconvenient operation, small space, narrow spacing between adjacent boards, etc., to achieve convenient installation and stability. contact effect

Inactive Publication Date: 2007-10-17
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the dense distribution of components on the additional board, the space is small and the distance between adjacent boards is narrow, it is easy to interfere with the adjacent boards by directly installing heat dissipation components on it, and it is inconvenient to operate.

Method used

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  • Heat radiator
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Embodiment Construction

[0015] Referring to FIGS. 1 to 3 , the heat dissipation device of the present invention includes two heat dissipation plates 20 disposed on both sides of an add-in card 10 and a pair of fixing clips 30 for fixing the two heat dissipation plates 20 to the add-in card 10 .

[0016] The add-on card 10 includes a circuit board 110 and a plurality of electronic components 120 disposed on two opposite sides of the circuit board 110 . A through hole 111 is respectively defined in the middle of the circuit board 110 close to the upper and lower edges.

[0017] The heat dissipation plate 20 is made of thermally conductive material such as copper or aluminum plate. A through hole 211 is formed in the middle of each cooling plate 20 near the upper and lower edges corresponding to the through hole 111 of the circuit board 110 . Two fixing members 25 such as pins pass through the through hole 211 and the through hole 111 to fix the two heat sinks 20 and the circuit board 110 . Two pairs ...

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Abstract

A heat-scattering equipment is used for scattering heat to the electric element on the card, which comprises heat sink adhered on both sides of the card and a fixation clamp for clamping the heat sink and card. The fixation clamp has two-pin-jointed splint which has a flexible member therebetween to make the one corresponding terminal of the two-pin-jointed splint clamp two heat sink flexibly so as to obtain a stable contact of the heat sink and the electric element on the card.

Description

【Technical field】 [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic components. 【Background technique】 [0002] With the continuous development of the computer industry, the operating frequency and speed of electronic components continue to increase, and the heat generated is increasing. If it is not removed in time, the accumulated heat will cause the temperature to rise and affect the normal operation of the heating electronic components. [0003] With the improvement of computer performance, the chip capacity on additional boards such as memory sticks and video cards is increasing day by day, the size is getting smaller and smaller, and the working speed is getting faster and faster. The heat generated in the process is also increasing. How to quickly replace these additional boards The rapid and effective dissipation of heat from the chip on the chip has become a problem that the industry needs to solve. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/367G06F1/20G12B15/00
Inventor 陈俊吉翁世勋余光周大远刘金标
Owner FU ZHUN PRECISION IND SHENZHEN