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Self-regulated cooling mechanism

A technology of cooling sheet and memory material, applied in the direction of instrument cooling, lighting and heating equipment, laminated components, etc., can solve problems such as component overheating, lifespan, performance and efficiency reduction, thermal cycle damage, etc.

Inactive Publication Date: 2008-05-07
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Often, the greatest danger to equipment is overheating of components, resulting in reduced lifespan, performance and efficiency
However, operation below the threshold temperature can also have undesired effects such as loss of efficiency, or damage from repeated thermal cycling
Also, while controlling only the upper end of the operating temperature range, the device must be designed to tolerate a wider range of operating temperatures

Method used

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  • Self-regulated cooling mechanism
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Embodiment Construction

[0021] The present invention effectively regulates the temperature within the desired operating temperature range by regulating the fluid flow through the cooling fins of the heat sink disposed on the heat generating device. This is accomplished using shape memory materials that expand and contract in the fluid path that flows through the cooling fins. The amount of heat dissipated is directly related to the flow rate of the fluid passing through the cooling fins. When the temperature of the heat-generating device drops below the desired operating temperature range, the shape memory material will stretch to restrict fluid flow through the cooling fins, thereby reducing the amount of heat dissipated. Conversely, when the temperature of the heat-generating device rises above the desired operating temperature range, the shape memory material will contract to allow the maximum amount of fluid to pass through the cooling fins, thereby maximizing the dissipated heat. By adjusting t...

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PUM

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Abstract

Regulating the temperature of a heat-generating device within a desired range using shape memory materials disposed on a heat sink. According to one embodiment, cooling fins are placed upon a heat-generating device. Fluid flows through the cooling fins to remove heat from the device. A shape memory material is placed within the path of fluid flow to regulate the amount of fluid flow in response to stimuli at desired low and high operating temperatures of the heat-generating device. At the low desired device operating temperature, the shape memory material restricts the amount of fluid flow through the cooling fins. At the high desired device operating temperature, the shape memory material does not restrict fluid flow through the cooling fins.

Description

technical field [0001] The present invention relates to regulating the temperature of heat-generating devices. Background technique [0002] Many types of equipment have optimum operating temperature ranges. To this end, a great deal of design and engineering focus has been focused on cooling to avoid shortening component life due to exposure to temperatures above the threshold temperature. Often, the greatest danger to equipment is overheating of components, resulting in reduced lifespan, performance and efficiency. However, operation below the threshold temperature can also have undesired effects, such as loss of efficiency, or damage from repeated thermal cycling. Furthermore, while only controlling the upper end of the operating temperature range, the equipment must be designed to tolerate a wider range of operating temperatures. [0003] Many cooling configurations employ systems that involve the use of cooling fins that carry heat away from the device. Fluid flow i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G12B15/02G12B15/06
CPCF28F3/02C08L2201/12G05D23/08H01L23/467F28F2255/04F28F27/00H01L2924/0002H01L2924/00
Inventor S·P·阿克萨米特C·麦迪纳J·G·麦克莱恩
Owner INT BUSINESS MASCH CORP