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Stack material monitoring device and method

A technology of monitoring devices and projection devices, which is applied in the direction of measuring devices, optical devices, instruments, etc., and can solve problems such as difficult to identify and difficult to identify

Inactive Publication Date: 2010-12-08
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the appearance of the chips is very similar, it is not easy to identify when they are stacked together, especially if they are hidden in an array of a group of chips, so a better design is needed to help solve the problem of stacking

Method used

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  • Stack material monitoring device and method
  • Stack material monitoring device and method
  • Stack material monitoring device and method

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Embodiment Construction

[0026] The direction of the present invention discussed here is a stack monitoring device and method. In order to provide a thorough understanding of the present invention, detailed steps and components thereof will be set forth in the following description. Clearly, the practice of the invention is not limited to specific details familiar to those skilled in the testing machine. On the other hand, the components or steps of well-known testing machines are not described in detail in order to avoid unnecessary limitations of the present invention. The preferred embodiments of the present invention will be described in detail as follows, however, the present invention can be widely implemented in other embodiments besides these detailed descriptions, and the scope of the present invention is not limited, which is subject to the claims.

[0027] First, please refer to figure 1 , is a schematic diagram of a stack monitoring device of the present invention. Such as figure 1 As ...

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Abstract

The objective of the invention is to provide a device for monitoring stacked materials, which comprises a projection device and a photograph device. The projection device projects image for a target plane at different angles and the photograph device photographs the picture for the target plane at different angles, thereby presenting a portion of the image superposed on the surface of the object in the picture to judge whether the stacked material problem happens, when placing the object on the target plane.

Description

technical field [0001] The invention relates to a semiconductor testing machine, in particular to a semiconductor testing machine using automatic image detection to judge stacking conditions and a monitoring method thereof. Background technique [0002] In the back-end manufacturing process of semiconductor chips, during the testing process of the device under testing (DUT), the chips to be tested are first placed in the in / out area of ​​the semiconductor testing machine, and then transferred to the tray ( tray), and then sent to the test area one by one or in groups by a horizontal and vertical pick and place device (pick and place) for testing, and after the test is over, they are placed on trays on good or bad tray racks according to the test results . [0003] Chips are generally arranged in an array on the tray. However, during the process of conversion or arrangement, chips may be repeatedly placed in the same position on the tray for some reason, resulting in overlap...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01B11/00
Inventor 林源记林世芳
Owner KING YUAN ELECTRONICS