Machining device
A technology for processing devices and processed objects, applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve problems such as missing input errors, achieve the effects of reducing input errors, making the content easy to understand, and promoting re-input
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Embodiment approach 1
[0027] This Embodiment 1 shows an example applied to a cutting device including a machining unit having a cutting insert as a processing device. figure 1 It is an external perspective view showing an example of the processing apparatus according to Embodiment 1 of the present invention, figure 2 It is a perspective view that extracts and expresses the structure around the processing unit. The processing device 10 of the first embodiment is applied to a cutting device that cuts the workpiece W along the planned dividing line. As a schematic configuration, it is as follows: figure 1 As shown, the processing device 10 includes a holding unit 11 , a camera unit 12 , a processing unit 20 , an operation panel 30 and a control unit 40 .
[0028] The machining unit 20 is a unit of a double-cutting type in which two cutting blades are arranged opposite to each other in the Y-axis direction and can perform cutting operations in parallel. , the half-cut is performed by the first cutti...
Embodiment approach 2
[0068] In Embodiment 2, an application example to a laser processing device having a processing unit having a laser beam irradiation unit for irradiating a workpiece with pulsed laser beams instead of a cutting blade is shown as a processing device. The holding unit of the workpiece, the X-axis moving unit relative to the holding unit, the Z-axis moving unit relative to the laser light irradiation unit, the Y-axis moving unit, and the control system can be configured in the same manner as in Embodiment 1, so It is an illustration and description of the configuration and control system of the laser processing apparatus according to the second embodiment.
[0069] Here, an example of display on the operation panel 80 of the second embodiment will be described. Figure 9 It is a front view showing an example of a processing condition setting screen displayed on the operation panel 80 when laser processing is performed on a workpiece by the laser processing apparatus according to ...
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