White light LED

A light-emitting diode and white light technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient life of white light-emitting diodes, limit the application of white light-emitting diodes, and not significantly reduce the light decay of white light-emitting diodes. Light decay rate, life-enhancing effects

Inactive Publication Date: 2009-05-20
NINGBO ANDY OPTOELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, at present, the above-mentioned various measures basically do not significantly reduce the light decay of white light emitting diodes, and the actual life of white light emitting diodes is still not long enough, which largely limits the application of white light emitting diodes in the field of lighting

Method used

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Embodiment Construction

[0020] The white light emitting diode disclosed by the present invention includes a bracket, a light emitting diode grain, a powder mixing glue and a fluorescent powder, the light emitting diode crystal grain is fixed on the bracket, the phosphor powder and the powder mixing glue are prepared in proportion, the powder mixing The glue is formed by proportioning the first adhesive mainly composed of polydimethylsiloxane and the second adhesive mainly composed of polymethylhydrogensiloxane and polydimethylsiloxane.

[0021] In this embodiment, the chip selects the light-emitting diode crystal grains with a blue light emission wavelength of 455-465nm, an insulating glue for the crystal-bonding glue (of course, silver paste can also be used), and the phosphor powder adopts silicate phosphor produced by Intematix Corporation of the United States. powder (of course, it can also be YAG yttrium aluminum garnet phosphor, TAG terbium aluminum garnet phosphor or sulfide phosphor, etc.), th...

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Abstract

The invention relates to a white light emitting diode which comprises a bracket, light emitting diode crystal grains, powder preparation glue and fluorescent powder; the light emitting diode crystal grains are fixed on the bracket; the fluorescent powder and the powder preparation glue are prepared according to proportion; the powder preparation glue is prepared from a first caking agent taking polydimethylsiloxane as a main body and a second caking agent taking polymethyl hydrogen siloxane and polydimethylsiloxane as a main body. Through using the mixture prepared from the first caking agent and the second caking agent to prepare the powder, the white light emitting diode greatly reduces the light decay rate; when standard current of 20 mA is adopted for driving, luminous flux of the light emitting diode is risen by 4 percent in 168 hours, stills keeps the rising rate of 4 percent in 336 hours and still has no light decay and has the rising rate of 3 percent in 1,000 hours, thereby substantially improving the service life of the white light emitting diode and vigorously promoting the application of the white light emitting diode in the illumination field.

Description

【Technical field】 [0001] The invention relates to a light-emitting diode, more specifically, to a white light-emitting diode. 【Background technique】 [0002] Light-emitting diode is a semiconductor light-emitting device, which is widely used as indicator lights, display screens, etc. White light-emitting diodes are known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. The theoretical lifespan of light-emitting diodes is about 100,000 hours. However, judging from the current white light-emitting diodes on the market, their lifespan is far from the theoretical 100,000 hours. Generally, at 1,000 hours, the light decay rate has reached more than 30%. , thus shortening the life of white light emitting diode products to a large extent. [0003] Packaging materials are one of the main factors that affect the light decay of white light emitting diodes. At present, conventional packaging materials for light emitting diodes mainly includ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 占贤武
Owner NINGBO ANDY OPTOELECTRONIC CO LTD
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