Optoelectronic products and manufacturing method thereof
A technology for optoelectronic components and optical components, applied in electrical components, manufacturing tools, electrical solid devices, etc., and can solve problems such as image sharpness loss
Inactive Publication Date: 2009-08-19
SCHOTT AG
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Problems solved by technology
The usual problem then is that if the aim is to maintain recording quality, then the tolerances for the alignment of the optics relative to the sensor surface must also be made smaller and smaller
Thus, in the case of very short focal lengths of miniaturized optical systems or optical elements arranged at a fixed distance from the chip, small deviations in distance can lead to a severe loss of achievable image sharpness
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[0059] The method steps for producing a composite wafer with a transparent cover for the optoelectronic circuits on the functional wafer are described with reference to FIGS. 1 to 4 . The method is based on encapsulation of optoelectronic components in a composite wafer by manufacturing a glass wafer and then mounting and fastening the glass wafer on the functional side of the functional wafer with electrical circuits on the functional wafer. In this case, the glass wafer is preferably produced with a thickness between 50 and 500 microns, and an average thickness tolerance of less than ±10 microns, preferably less than ±6 microns. In this case, the thickness of the optical glass wafer fluctuates at most ±10 microns, preferably at most ±6 microns.
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Abstract
The invention relates to the production of optoelectronic components, whereby optical components are applied to the wafer composite. For this purpose, the invention provides a method for producing optoelectronic components, especially image signal-detecting or image signal-transmitting components. According to said method, optical components are made available, picked up and placed on a wafer, the optical components being preferably positioned either one by one or in groups relative to the position of associated optoelectronic or optical components of the wafer or of the wafer to be connected therewith.
Description
technical field [0001] The present invention generally relates to optoelectronic components and products thereof. In particular, the invention herein relates to the joining of optical components with optoelectronic functional substrates, such as optoelectronic chips or functional wafers with optoelectronic chips. Background technique [0002] Increasing miniaturization will be observed even in the case of optoelectronic components. Consequently, even smaller camera modules are being developed in order to equip mobile phones with them. As camera chips are miniaturized, the associated optical systems are also shrinking. Chips thus often have an active sensor surface in the order of one or a few square millimeters. In order to ensure sufficient light-gathering power of the relevant objective lens, the distance of the optical elements from the chip surface is correspondingly reduced. There is then the usual problem that if the aim is to maintain the recording quality, the to...
Claims
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IPC IPC(8): H01L27/146C03B11/08C03C19/00H04N25/00
CPCC03B17/06H01L27/14632C03B2215/05C03B2215/414C03B11/082C03C19/00H01L27/14687H01L27/14625C03C17/02H01L27/14685H01L27/14618H01L27/14621H01L27/1462H01L31/0203H01L31/0232H01L2924/0002H01L31/02325Y10T29/4913Y10T29/49131Y10T29/49133Y10T29/49137H01L2924/00H01L27/15H01L33/005H01L33/58H01L2933/0058
Inventor E·波罗斯基R·比尔特昂普菲尔B·沃芬戈F·弗蕾斯纳P·奥奇特-克鲁梅尔U·布劳奈克J·S·海登U·福瑟硬汉姆
Owner SCHOTT AG
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