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Grinding unit and grinding method for magnetic head slider

A technology of a grinding device and a grinding method, which is applied in the directions of grinding machines, grinding machine parts, grinding/polishing equipment, etc., can solve problems such as shortening the service life of flat discs, and achieve the effect of suppressing deviation.

Inactive Publication Date: 2009-09-30
SAE MAGNETICS (HK) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This reaction force causes fine damage to the plate, and the life of the plate is shortened due to the use of a mirror-finished plate with extremely high accuracy in the surface finishing and grinding process.

Method used

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  • Grinding unit and grinding method for magnetic head slider
  • Grinding unit and grinding method for magnetic head slider
  • Grinding unit and grinding method for magnetic head slider

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] An embodiment of the grinding device and grinding method of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] First, an element to be polished will be described using this example. figure 1It is a perspective view of a component bar on which a plurality of components to be a magnetic head slider are arranged. The device bar B is diced from a part of the plurality of devices S formed on the wafer. Each element S includes an MR element M as a readout element. The MR element M is formed facing the air bearing surface and is ground to a specific element height. Therefore, the air bearing surface forming the MR element M becomes the ground surface LS of the element bar B. As shown in FIG. An element gap (gap) G is provided between the elements S arranged in a row. In the element gap G, the RLG element R facing the grinding surface LS is provided. The RLG element has, for example, the same film structure as the ...

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PUM

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Abstract

The invention provides a grinding device and a grinding method for inhibiting deviation of grinding quantity of an element in a surface processing grinding process after an element height forming grinding process. The magnetic head slider grinding device 1 comprises a grinding head 2, a support structure, a base and a decompression structure, wherein the grinding head 2 can compress and support an element to be a magnetic head slider S on a rotating grinding flat pan; the support structure is provided with a first embedding part 12 extended along the vertical direction, and supports the grinding head; the base is provided with a second embedding part 13 extended along the vertical direction, and supports the support structure; the second embedding part 13 and the first embedding part 12 are mutually embedded, and an inner space is formed between the second embedding part 13 and the first embedding part 12; the decompression structure decompresses the inner space; and the support structure is applied with the force of the decompressed inner space along the vertical direction, and the base can movably support the support structure along the vertical direction.

Description

technical field [0001] The present invention relates to a grinding device and a grinding method of a magnetic head slider (slider), in particular to the grinding device and the grinding method used in the surface processing grinding process after the component height formation grinding process. Background technique [0002] The magnetic head slider used in the hard disk drive goes through the wafer process of forming the read / write element, the process of cutting the element block (block) and the element bar (bar), and the grinding process of forming a predetermined air bearing surface. Made by other processes. The grinding process usually consists of two to three separate grinding processes. [0003] The first step of the lapping process is a rough lapping process for improving the efficiency of the following element height forming process. Sometimes this step is also omitted. In the rough grinding process, the element block and the element bar formed by a plurality of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/26B24B49/10
Inventor 小林正阿部清彦土屋浩康谭·桑托斯魏忠献张春华李发洪陈明远
Owner SAE MAGNETICS (HK) LTD