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Fuse part of semiconductor device and manufacturing method

A semiconductor and fuse technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reducing the yield of semiconductor device manufacturing processes

Inactive Publication Date: 2011-12-07
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This in turn significantly reduces the yield rate of the semiconductor device manufacturing process

Method used

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  • Fuse part of semiconductor device and manufacturing method
  • Fuse part of semiconductor device and manufacturing method
  • Fuse part of semiconductor device and manufacturing method

Examples

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Embodiment Construction

[0028] Other objects and advantages of one or more embodiments can be read from the following description, and become apparent by reference to one or more embodiments. In the drawings, the dimensions of layers and regions are exaggerated for clarity of illustration. It will also be understood that when a layer (or film) is referred to as being "on" another layer or substrate, this means that it may be directly on the other layer or substrate, or that one or more layers may also be present. Multiple insert layers. Further, it will also be understood that when a layer is referred to as being "under" another layer, it can be directly under, and one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being 'between' two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. It should also be noted that like reference numerals designate like elements / el...

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Abstract

The present invention relates to a fuse part of a semiconductor device and a manufacturing method thereof. A fuse part of a semiconductor device includes: an insulating layer on a substrate; and a fuse on the insulating layer, wherein the fuse includes a plurality of The blown pads of the laser beam, the plurality of blown pads have different laser coordinates from each other.

Description

[0001] related application [0002] This application claims priority from Korean Patent Application No. 10-2008-0030561 filed Apr. 2, 2008, which is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates to semiconductor devices, and more particularly, to a fuse part of a semiconductor device and a method of manufacturing the same. Background technique [0004] When a semiconductor device is highly integrated, the semiconductor device includes many tiny memory cells. Therefore, there is a possibility that a defect occurs in a part of the memory cell during the manufacture of the semiconductor device. Even when a defect occurs in only one memory cell, the corresponding semiconductor device is rejected as an inferior product. [0005] In other words, even if a defect occurs only in some memory cells out of the entire extremely large number of memory cells of the semiconductor device, the entire semiconductor device is reject...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L23/52H01L21/311
CPCH01L23/5258H01L2924/0002H01L2924/00H01L21/82
Inventor 南相润
Owner SK HYNIX INC