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Clamp for fixing base plates

A technology for fixing substrates and fixtures, which is applied in the direction of electrical components, electrical components, and electrical components to assemble printed circuits, etc., and can solve problems such as product damage and heat-resistant tape product pollution

Inactive Publication Date: 2009-10-14
SAMSUNG ELECTRONICS SUZHOU SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned method, due to the use of a knife and tweezers, it is easy to cause damage to the product, and the fragments of the heat-resistant tape are likely to pollute the product

Method used

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  • Clamp for fixing base plates
  • Clamp for fixing base plates
  • Clamp for fixing base plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Embodiments of the invention are shown in the drawings, and like reference numerals refer to like components throughout. The size or relative sizes of components may be exaggerated for clarity.

[0015] figure 1 It is the plan view of the fixture and PCB board installed together.

[0016] Such as figure 1 As shown, the fixture 100 and the PCB board 200 are mechanically fixed together. The frame shape of the clamp 100 is rectangular, but the specific shape of the clamp can be determined according to the equipment in the process and the shape of the PCB board to be fixed, therefore, the specific shape of the clamp is only illustrative and does not limit the scope of the present invention .

[0017] Specifically, in this embodiment, the clamp 100 is a frame similar to an inverted "day" shape (such as figure 1 As shown), it includes three vertical supports 101...

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PUM

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Abstract

The invention provides a clamp for fixing base plates. The clamp is provided with a frame structure comprising a bracket; the bracket comprises a main body provided with a bulge, a cover covered on partial main body, a slip thimble and a built-in spring; the slip thimble is positioned between the main body and the cover, and the two ends extend out of the cover; the built-in spring is positioned between the main body and the cover, and is arranged vertical to the slip thimble; when the base plate is disposed on the clamp, the slip thimble and the bulge are respectively inserted into the concave port and the hole at both sides of the base plate. The clamp can fix the base plate firmly when no high-temperature tape is needed, thereby reducing the production cost and decreasing the pollution of the high-temperature tape fragment on the base plate.

Description

technical field [0001] The invention relates to a jig for fixing a substrate, more particularly, to a jig for fixing a substrate before a mounting process in a semiconductor surface mounting process. Background technique [0002] With the miniaturization of electronic products, the electronic components designed become smaller and smaller. The originally widely used plug-in components can no longer meet the requirements in this regard, so surface mount technology (SMT, Surface Mounting Technology) is widely used. [0003] SMT is a new generation of electronic assembly technology, which compresses traditional electronic components into devices with only a few tenths of the volume, thus realizing high density, high reliability, miniaturization, low cost and automatic production of electronic product assembly. Such miniaturized components are called SMC (Surface Mounted components) devices. The process method of assembling SMC devices on printed circuit boards is called SMT p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K13/04
Inventor 汪胜琴郭士达
Owner SAMSUNG ELECTRONICS SUZHOU SEMICON