Metal-based composite medium copper-clad foil plate

A metal-matrix composite and copper-clad laminate technology, applied in the direction of metal layered products, synthetic resin layered products, layered products, etc., can solve the problems that cannot meet the needs of high-performance metal matrix composite materials

Inactive Publication Date: 2009-10-28
顾根山
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the insulation medium of metal-based copper-clad insulation boards in the market is composed of epoxy resin or anti-modification epoxy resin, which cannot meet the needs of high-frequency and microwave-based high-performance metal-based composite materials for the development of electronic communications.

Method used

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  • Metal-based composite medium copper-clad foil plate

Examples

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Embodiment 1

[0009] Embodiment 1, as shown in the accompanying drawings, the preparation process is to add tetrafluoroethylene and ceramics or rutile to the raw materials, or mix polytetrafluoroethylene, ceramics and rutile in proportion, dry several times, and sinter to form a composite material layer; proportioning copper, aluminum or iron in proportion, treating the copper, aluminum or iron-based surface, bonding composite material layer 2 and copper, aluminum or iron 1 with thermally conductive adhesive powder, composite material layer and copper foil 3 Carry out one-time compression molding. The weight ratio of the three layers is controlled in the range of metal base:composite material:copper foil=4-7:2-5:0.1-2. The weight ratio of polytetrafluoroethylene to ceramics and rutile, single ceramics or single rutile is controlled in the range of 5-7:2-5.

Embodiment 2

[0010] Embodiment 2. The composite material layer 2 is glass cloth with polytetrafluoroethylene coating, and the polytetrafluoroethylene coating of the glass cloth is several to dozens of layers according to requirements. All the other preparation processes are the same as in Example 1.

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Abstract

The invention discloses a metal-based composite medium copper-clad foil plate. A composite material layer is covered on a metal plate of the metal-based composite medium copper-clad foil plate, and a copper foil is covered on the composite material layer, wherein the composite material layer can be glass cloth with a polyfluortetraethylene coating, a mixture of polyfluortetraethylene and ceramics or rutile, or a mixture of polyfluortetraethylene, ceramics and rutile. The metal-based composite medium copper-clad foil plate meets the requirement of the development of electronic communication on high-frequency and microwave high-performance metal-based composite materials.

Description

technical field [0001] The invention relates to a metal matrix composite dielectric copper clad board. Background technique [0002] At present, the insulating medium of metal-based copper-clad insulating boards on the market is composed of epoxy resin or anti-modified epoxy resin, which cannot meet the needs of high-frequency and microwave-based high-performance metal-based composite materials for the development of electronic communications. Contents of the invention [0003] In order to solve the above problems, the present invention provides a high-frequency, microwave-based high-performance metal-matrix composite dielectric copper-clad laminate. [0004] The invention relates to a metal-based composite dielectric copper-clad board. The metal plate is covered with a composite material layer, and the composite material layer is covered with copper foil; the composite material layer can be glass cloth with a polytetrafluoroethylene coating, or can be A mixture of PTFE a...

Claims

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Application Information

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IPC IPC(8): B32B15/04B32B15/20B32B17/04B32B27/20
Inventor 顾根山
Owner 顾根山
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