Binder as well as preparation method and application thereof

A technology of binder and dispersant, which is applied in the field of binder and its preparation, can solve problems such as injection defects, difficulty in automatic production, and low strength of sintered billets, so as to avoid rearrangement and agglomeration, facilitate automatic production, and feed material surface smooth effect

Active Publication Date: 2020-10-13
浙江昶研新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of thermoplastic binder, due to the addition of a large number of low-molecular organic components, such as wax, stearic acid, vegetable oil, oleic acid, plasticizers, etc., has an extremely low melting point and is easily soluble in organic solvents. , accounting for more than 50% of the binder, and some formulas even reach more than 70%, making this kind of binder very easy to obtain low-viscosity, high-fluidity feed, but in the long-term use process, there are the following Disadvantages: (1) Too many low-molecular components are prone to injection defects, such as shrinkage cavities, surface bubbling, weld lines and other defects; (2) The strength of the prepared green body is low, and the tailings are difficult to come out, making it difficult to realize automatic production ;(3) In the process of solvent degreasing, polymer swelling is easy to occur, and the particles are easily rearranged, causing deglue bubbling, cracking, and size deformation; (4) The degumming process requires a large amount of organic solvents, which is not environmentally friendly; (5) Due to the high proportion of the binder with a low melting point, the process of solvent degreasing and thermal degreasing will cause particle rearrangement, local agglomeration, resulting in more micropores and low sintering strength

Method used

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  • Binder as well as preparation method and application thereof
  • Binder as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The following components were weighed in parts by weight: 7 parts of microcrystalline wax, 40 parts of 1# polyacrylic resin, 30 parts of 2# polyacrylic resin, 20 parts of PS: 1.5 parts of DOP, and 1.5 parts of dispersant.

[0041]The 1# polyacrylic resin is a polyacrylic resin with a molecular weight of 120,000 and a Tg of 110°C, and its thermal decomposition temperature is 235°C; the 2# polyacrylic resin is a polyacrylic resin with a molecular weight of 40,000 and a Tg of 35°C. The decomposition temperature is 280°C, the decomposition temperature of the PS is 320°C, and the dispersant is an anionic polyacrylic dispersant.

[0042] Put the weighed material into a double-helix high-temperature mixer, stir and mix at a temperature of 120°C for 4 hours, and the stirring rate is 1000 rpm. The binder is poured into a ceramic crusher, crushed into particles with a diameter of 1mm, and packaged for storage.

Embodiment 2

[0044] The following components were weighed in parts by weight: 10 parts of microcrystalline wax, 45 parts of 1# polyacrylic resin, 35 parts of PS, 5 parts of EVA, 1.5 parts of DOP, and 3.5 parts of dispersant.

[0045] The 1# polyacrylic resin is a polyacrylic resin with a molecular weight of 200,000, a Tg of 65°C, and a thermal decomposition temperature of 245°C; the decomposition temperature of the PS is 325°C, and the decomposition temperature of the EVA is 420°C. The dispersant is an anionic polyacrylic dispersant.

[0046] Put the weighed material into a double-helix high-temperature mixer, stir and mix at a temperature of 140 ° C for 3 hours, and the stirring speed is 900 rpm. The binder is poured into a ceramic crusher, crushed into particles with a diameter of 2mm, and packaged for storage.

Embodiment 3

[0048] The following components were weighed in parts by weight: 5 parts of microcrystalline wax, 47 parts of 1# polyacrylic resin, 35 parts of PS, 7 parts of EVA, 2.5 parts of DOP, and 3.5 parts of dispersant.

[0049] The 1# polyacrylic resin is a polyacrylic resin with a molecular weight of 400,000, a Tg of 105°C, and a thermal decomposition temperature of 210°C; the decomposition temperature of the PS is 325°C, and the decomposition temperature of the EVA is 420°C. The dispersant is an anionic polyacrylic dispersant.

[0050] Put the weighed material into a double-helix high-temperature mixer, stir and mix at a temperature of 160°C for 2 hours, and the stirring speed is 800 rpm. The binder is poured into a ceramic crusher, crushed into particles with a diameter of 3mm, and packaged for storage.

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Abstract

The invention discloses an adhesive as well as a preparation method and application thereof. The adhesive is prepared from, by weight, 3-10 parts of low-molecular-weight wax components, 20-50 parts of1 # polyacrylic resin, 0-30 parts of 2 # polyacrylic resin, 5-15 parts of high-temperature decomposition resin, 0.5-2 parts of plasticizer and 0.1-3 parts of dispersing agent. The preparation methodof the binder comprises the following steps of: (1) weighing the components; (2) performing stirring at high temperature; and (3) performing crushing and granulating. The binder is used for preparingaluminum oxide or zirconium oxide thermal degreased injection-molded ceramic. An injected ceramic green body applying the binder can be directly subjected to whole-course thermal degreasing, is smoothin feeding surface, is high in strength, is good in flowability and easy to automatically produce; the prepared injection-molded ceramic product has few pores, high density, high hardness and strength and excellent comprehensive performance.

Description

technical field [0001] The invention belongs to the field of ceramic materials, and in particular relates to a binder and a preparation method and application thereof. Background technique [0002] Ceramic injection molding technology is a relatively new near-net molding technology developed in the past ten years. It is used more and more in the ceramic industry. It has the advantages of one-time molding of complex shape products, high dimensional accuracy of products, and no need for machining Or it only needs micro-processing, easy to realize production automation and excellent product performance. It is suitable for manufacturing ceramic parts in large quantities and makes up for the shortcomings of traditional ceramic forming processes. [0003] However, since ceramic powder particles are basically nano or submicron powders, especially zirconia and alumina ceramics, the powder particle size is small, the specific surface area is high, the shape is irregular, and the surf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/634C04B35/632C04B35/10C04B35/48
CPCC04B35/634C04B35/63424C04B35/63408C04B35/63416C04B35/63432C04B35/632C04B35/10C04B35/48
Inventor 梁良华王雅雷刘怀菲游峰
Owner 浙江昶研新材料有限公司
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