Chip encapsulating structure

Abstract

The invention relates to a chip encapsulating structure. The chip encapsulating structure comprises a base plate and a plastic injection material, wherein a plurality of holes are arranged on the baseplate and correspond to a ditch of a lower mould; at least one part of the plastic injection material can penetrate through at least one hole, enters the ditch, penetrates through at least one hole by the ditch and enters a clearance between a chip and the base plate. Therefore, the plastic injection material can be completely filled in the clearance between the chip and the base plate.

Description

technical field [0001] The invention relates to a chip packaging structure; in particular, a substrate is provided with a plurality of openings to match a mold for complete sealing of injection molding materials. Background technique [0002] After the semiconductor chip is manufactured, it needs to form a chip packaging structure together with a substrate with a conductive structure, so as to exert the circuit function. The existing chip packaging technology has the active surface of the chip attached to the conductive structure of the substrate, so that the joints on the active surface, such as pads (PAD) or bumps (Bump), are directly bonded to the conductive structure . This packaging technology needs to first place the chip and the substrate in a position to face each other. Generally speaking, it is usually achieved by flipping the chip. Therefore, the aforementioned packaging technology is also called flip-chip packaging (Flip-Chip) technology. Flip-chip packaging h...

AI Technical Summary

Problems solved by technology

Bottom filling molding uses the capillary phenomenon between the chip and the substrate to complete the sealing. The disadvantage is that it takes a long time and is not conducive to mass production; transfer injection molding uses pressure difference to induce the injection material to flow into the narrow gap between the chip and the substrate. space, the disadvantage is that the injection molding material is often not filled under the chip, forming an incomplete sealant

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