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Printed circuit board

A technology of printed circuit boards and electronic components, which is applied in the fields of printed circuit, printed circuit, and printed circuit manufacturing, and can solve problems such as time-consuming and labor-intensive, the inability to use SMD packaging methods, and undetermined product specifications.

Inactive Publication Date: 2010-03-10
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the early stage of the development of the existing printed circuit board 2, it is inevitable that the product specification has not been determined due to the needs of different manufacturers, or the circuit needs to be modified many times when making samples.
Under normal circumstances, it is necessary to remove the original chip component 10, and then reconnect the first pad 6 and the second pad 7 by jumper wires, which is not only time-consuming and laborious, but also cannot use the original chip packaging method, which greatly affects Overall layout of the printed circuit board 2

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0013] see figure 2 , the printed circuit board 100 according to the first embodiment of the present invention has at least one wiring layer 20 on which at least one first electronic component 21 and one second electronic component 22 are mounted. The first electronic component 21 has at least two first pins 21A, and the second electronic component 22 has a second pin 22A corresponding to the first pins 21A. A plurality of adjacent first pads 21B and second pads 22B arranged in a matrix are arranged between the first pin 21A and the second pin 22A. The first pins 21A are sequentially connected alternately with the first pads 21B and the second pads 22B, and the second pins 22A are sequentially corresponding to the second pads adjacent to the first pads 21B. The bonding pad 22B and the first bonding pad 21B adjacent to the second bonding pad 22B are alternately connected, so that there are more connection combinations between the first electronic component 21 and the second e...

no. 2 approach

[0018] see image 3 , the printed circuit board 200 of the second embodiment of the present invention can realize three-way signal transmission, and it is different from the printed circuit board 100 of the first embodiment in that: the first electronic component 21 has three sequential The second electronic component 22 has three second pins 22A1 , 22A2 , 22A3 arranged in sequence. The first pads 21B and the second pads 22B form a 2*3 matrix arrangement, the first pads 21B are respectively 21B1, 21B2, and 21B3, and the second pads 22B are respectively 22B1, 22B2, and 22B3 . In this structure, in order to obtain more connection combinations, the first wiring method can be used: connect the first pad 21B2 to the second pin 22A2, connect the second pad 22B2 to the first pin 21A2, and connect the The first pads 21B1, 21B3 are connected to the first pins 21A1, 21A3 respectively, and the second pads 22B1, 22B3 are connected to the second pins 22A1, 22A3 respectively. This structu...

no. 3 approach

[0021] see Figure 4 , the printed circuit board 300 of the third embodiment of the present invention is different from the printed circuit board 100 of the first embodiment or the printed circuit board 200 of the second embodiment in that: the first pin 21A , the second pin 22A, the first pad 21B, the second pad 22B and the number of conductive elements 30 are 4 respectively, and four signals can be realized between the first electronic element 21 and the second electronic element 22 transmission.

[0022]The four first pins are respectively 21A1, 21A2, 21A3, 21A4, and the four second pins are respectively 22A1, 22A2, 22A3, 22A4. The four first pads 21B1 , 21B2 , 21B3 , 21B4 and the second pads 22B1 , 22B2 , 22B3 , 22B4 form a 2*4 matrix arrangement. In this embodiment, while the first pads 21B2, 21B4 are respectively connected to the second pins 22A2, 22A4, the second pads 22B2, 22B4 are respectively connected to the first pins 21A2, 21A4, while the first pads 21B1, 21B3 ...

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Abstract

The invention relates to a printed circuit board which is provided with at least one wiring layer, wherein at least one first electronic component and one second electronic element are installed on the wiring layers; the first electronic component is provided with at least two first pins, and the second electronic element is provided with second pins corresponding to the first pins; a plurality ofadjacent first pads and second pads are arranged between the first pins and the second pins; the first pads are adjacent to the first pins, and the second pads are adjacent to the second pins; the first pins are alternately connected with the first pads and the second pins in sequence, and the second pins are alternately connected with the second pads adjacent to the first pads and the first padsadjacent to the second pads correspondingly in sequence so that more connecting combinations are arranged between the first electronic component and the second electronic element.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] Such as figure 1 As shown, the existing printed circuit board 2 has at least one wiring layer 3 on which at least one first electronic component 4 and one second electronic component 5 are mounted. The first electronic component 4 has at least two first pins 8 defined as output terminals, and the second electronic component 5 has a second pin 9 defined as an input terminal corresponding to the first pins 8 . A plurality of first pads 6 and second pads 7 arranged in a matrix are arranged between the first pins 8 and the second pins 9 . The plurality of first pins 8 are electrically connected to the first pads 6 in one-to-one correspondence, and the plurality of second pins 9 are electrically connected to the second pads 7 in a one-to-one correspondence. When each group of the first pads 6 and the second pads 7 are soldered to the patch component 10 , a unique electrical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/34
CPCH05K1/111H05K2201/10287H05K2201/10522H05K2203/173H05K1/029H05K2201/09954H05K2201/10636H05K1/0295Y02P70/50
Inventor 欧文钦杨铭梁
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD