Numerical-control silicon briquette double-surface lapping machine

Abstract

The invention provides a numerical-control silicon briquette double-surface lapping machine. The machine comprises a lathe bed, a workbench, a saddle, a sliding plate and a grinding head, wherein the grinding head comprises a grinding carriage, a grinding wheel spindle, a grinding wheel motor and a grinding disc; the linear guide rail and a ball screw are arranged in the middle of the lathe bed; the workbench is arranged on the linear guide rail and the ball screw; the saddle is provided with a linear guide rail and a ball screw; the sliding plate is arranged on the saddle through the linear guide rail and the ball screw; and the grinding head is arranged on the sliding plate. The machine is characterized in that the grinding disc is a diamond brush flexible grinding disc. The grinding disc adopts the diamond brush flexible grinding disc, small positive pressure and small grinding amount are generated in a grinding process, so that the machine can improve yield of the silicon briquette and ensure the finished product quality of the silicon briquette, and the manufactured silicon briquette need not maintain great machining allowance.

Description

technical field [0001] The invention relates to the field of CNC machine tool automation, in particular to a CNC silicon block double-plane grinder. Background technique [0002] The photovoltaic industry is an emerging industry. With the rapid development of the photovoltaic industry, the demand for mono- and polycrystalline silicon for solar power generation is increasing, and the requirements for processing equipment for mono- and polycrystalline silicon are higher. In order to eliminate cracks on the surface of the workpiece, reduce stress, and improve yield during the processing of polysilicon, the surface of the silicon block and the R angle must be ground. In the existing domestic and foreign processing equipment, the diamond grinding wheel is used to carry out plane grinding and dressing on the silicon surface. Although the grinding and dressing of this grinding equipment can eliminate the surface cracks of the silicon block, because the diamond grinding wheel is a h...

AI Technical Summary

Problems solved by technology

In the existing processing equipment at home and abroad, the diamond grinding wheel is used to carry out plane grinding and dressing on the silicon surface. Although the grinding and dressing of this grinding equipment can eliminate the cracks on the surface of the silicon block, because the diamond grinding wheel is a hard material, it is difficult to The frontal pressure generated during the grinding process is relatively large, which will generate new tiny cracks and other damages, seriously affecting the yield of silicon blocks, and the quality is difficult to guarantee. Due to the large amount of diamond grinding wheel grinding, silicon blocks need to retain a lot of processing margin

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