Unenclosed high-speed gas flow adsorption and transport device

Abstract

The invention discloses an unenclosed high-speed gas flow adsorption and transport device which is used for picking up grouped flaky workpieces and solves the problems of low efficiency, incapability of picking up the grouped flaky workpieces and the like in the prior art. The unenclosed high-speed gas flow adsorption and transport device comprises a gas path control unit, a suction cup and a movement control unit. The unenclosed high-speed gas flow adsorption and transport device is characterized in that the suction cup consisting of a gas needle and a suction cup body is hermetically assembled on a suction cup base and fixed together with the movement control unit; a gas chamber of the suction cup base is respectively communicated with a compressed gas cavity of the gas path control unit and a gas inlet of the gas needle; a gas flow quickly passes through an inner cavity of the gas needle through the gas chamber and the gas inlet to form a high-speed gas flow; and the high-speed gas flow passes through the interior of an open flow guide groove on the surface of the suction cup body to generate a pressure difference for adsorbing flaky workpieces. The unenclosed high-speed gas flow adsorption and transport device has compact structural design, reasonable gas path distribution and wide range of application; by adopting an independent and open gas path of a single workpiece, the picking up and the transport of the grouped flaky workpieces are not influenced by the invalid adsorption of a single flaky workpiece, and the rate of finished products, the safe reliability of the transport and the production efficiency are obviously improved.

Description

technical field [0001] The invention relates to a pick-up and transmission device for thin workpieces in the semiconductor wafer and solar cell manufacturing process, in particular to a non-enclosed high-speed air flow adsorption transmission device for picking up groups of thin workpieces in an open air path . The device is very suitable for picking up and transporting a whole group of thin sheet workpieces arranged closely in millimeter thickness, and also suitable for other workplaces that need to transfer various groups of thin sheet products. Background technique [0002] At present, for the pick-up and transmission of thin workpieces in semiconductor wafers and solar cell manufacturing processes, since wafers and solar cell thin slices are thin workpieces with a thickness of less than millimeters, and the distance between each piece in the storage container is often It is less than 4 mm, so it is easy to break. Most manufacturers often use manual methods to transfer ...

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