Method for laminating covering film of flexible printed circuit board

Abstract

The invention provides a method for laminating a covering film of a flexible printed circuit board, which comprises the following steps: S1: a positioning member is arranged in a positioning hole on a lamination platform surface, wherein the horizontal size of the positioning hole is larger than the size of the part, of the positioning hole, corresponding to the positioning member so that the positioning member can move in the positioning hole; S2: a flexible printed circuit board provided with a first alignment hole is sleeved in the positioning member along the first alignment hole; S3: a covering film provided with a second alignment hole is sleeved in the positioning member; S4: the positioning member is moved until the flexible printed circuit board and the covering film are positioned on the platform surface naturally and flatly; and S5: the flexible printed circuit board and the covering film are laminated. The lamination method provided by the invention enables the positioningmember to freely move on the lamination platform surface in a certain range, and can realize movement compensation for swelling and retraction of the printed circuit board and the covering film, thusthe lamination precision of the flexible printed circuit board and the covering film is enhanced.

Description

technical field [0001] The invention relates to a composite method, in particular to a composite method of a flexible printed circuit board cover film. Background technique [0002] With the growth and development of the flexible printed circuit board (FPC for short) industry, the manufacturing process and precision requirements of FPC are getting higher and higher. In the FPC manufacturing process, the composite accuracy of the cover film directly determines whether the accuracy of the shape, size, and area of ​​the FPC pad meets the customer's standards. [0003] In the FPC process, drilling, copper plating, lamination, chemical research and other high-temperature and high-pressure processes are required before the cover film compounding process. Due to the physical characteristics of the FPC and the cover film itself, it will produce a slight swelling under the high-temperature and high-pressure ring mirror. This kind of slight expansion and contraction has a major impac...

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to provide a simple operation and low cost that can greatly improve the composite accuracy of the FPC cover film for the defects of low composite precision of the flexible printed circuit board cover film and high defect rate of FPC products in the prior art, thereby Composite method for flexible printed circuit board cover film to improve product qualification rate

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