Electrostatic treatment method and device for vacuum dry etching machine
A technology of dry etching and vacuum, which is applied in the direction of circuit devices, emergency protection circuit devices, emergency protection circuit devices for limiting overcurrent/overvoltage, etc., and can solve the problem of high failure rate of chip transfer
Active Publication Date: 2011-11-30
FOUNDER MICROELECTRONICS INT
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[0005] In view of this, an embodiment of the present invention provides an electrostatic treatment method and device for a vacuum dry etching machine to solve the problem of high failure rate of vacuum dry etching machine transfer in the prior art
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[0016] In the embodiment of the present invention, in order to effectively remove the static electricity on the vacuum dry etching machine, the opening and closing of the electrostatic discharge control module is used to control the opening and closing of the electrode and the ground, thereby effectively releasing the static electricity on the vacuum dry etching machine, thereby reducing the vacuum. The failure rate of dry etching machine transfer sheet.
[0017] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0018] figure 1 A schematic diagram of the composition and structure of a vacuum dry etching machine provided in an embodiment of the present invention, the vacuum dry etching machine includes: an electrode 10 and a robot arm 11, wherein the gripper connected to the robot arm is used for grabbing the electrodes The wafer transported on the top, and in the embodiment of the present invention, ...
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The invention discloses an electrostatic processing device for a vacuum dry etching machine, and the device is used for solving the problem of the high slice-spreading failure rate of the vacuum dry etching machine in the prior art. The electrostatic processing device comprises an electrode and a mechanical arm. The vacuum dry etching machine comprises an electrostatic releasing control module, wherein one end of the electrostatic releasing control module is connected to the electrode while the other end of the electrostatic releasing control module is grounded, and the electrostatic releasing control module is used for controlling the connection and disconnection between the electrode and the ground. The embodiment of the invention also provides an electrostatic processing method for the vacuum dry etching machine. According to the scheme provided by the invention, the electrostatic releasing control module is used for controlling the connection and disconnection between the electrode and the ground, thereby realizing releasing the static electricity gathered on the vacuum dry etching machine to the ground and reducing the slice-spreading failure rate of the vacuum dry etching machine.
Description
technical field [0001] The invention relates to the technical field of semiconductor production, in particular to an electrostatic treatment method and device for a vacuum dry etching machine. Background technique [0002] Static electricity often occurs in daily life and work. A walking or sitting up can reach an electrostatic voltage of tens of thousands of volts. In the semiconductor production process, the vacuum dry etching machine is one of the most active places for static electricity. For example, vacuum dry etching machine AM8330. Under a certain vacuum condition, when a certain power radio frequency (13.56MHZ) power supply is added to the electrode of the vacuum dry etching machine, the gas molecules in the vacuum collide, rub, decompose and ionize under the action of the radio frequency electric field to produce A large number of conductive aggregates such as ions, electrons, and free radical atomic groups. [0003] In an environment including conductive aggreg...
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IPC IPC(8): H02H9/04
Inventor 左迪建张进
Owner FOUNDER MICROELECTRONICS INT