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Heat dissipation apparatus possessing tilting double fans

A heat dissipation device and fan technology, which can be used in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., and can solve problems such as poor heat dissipation efficiency of radiators

Active Publication Date: 2012-02-01
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, some of the wind blown from the first fan must flow through the middle part of the radiator to dissipate heat from the middle part, thereby solving the problem of heat dissipation caused by the down-blown double fans in the prior art. The problem of poor cooling efficiency in the middle part of the radiator of the device

Method used

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  • Heat dissipation apparatus possessing tilting double fans
  • Heat dissipation apparatus possessing tilting double fans
  • Heat dissipation apparatus possessing tilting double fans

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Embodiment Construction

[0013] figure 1 , 2 A preferred example of a heat sink 1 of the present invention is shown. Such as figure 1 As shown, the heat dissipation device 1 is mounted on a circuit board 6, and includes a windshield 2, a radiator 3, a first fan 4 and a second fan 5, wherein:

[0014] The windshield 2 includes a first through hole 222 and a second through hole 224 arranged longitudinally at intervals.

[0015] The radiator 3 is arranged in the windshield 2 and includes a plurality of cooling fins 30 arranged laterally at intervals.

[0016] The first fan 4 is arranged on the windshield 2 and is located in the first through hole 222 of the windshield 2, and the second fan 5 is arranged on the windshield 2 and is located in the first through hole 222 of the windshield 2. In the second through hole 224 of the windshield 2. The wind generated by the first fan 4 and the second fan 5 blows towards the radiator 3 .

[0017] Wherein, the windshield 2 is mainly used to fix the first and s...

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Abstract

The invention discloses a heat dissipation apparatus possessing tilting double fans. The apparatus comprises a radiator, a first fan and a second fan. The first and second fans are arranged obliquely and inclination directions of the first and second fans are the same. Therefore, wind blown from the first fan is inevitably flowed through a middle part of the radiator, which can be used to carry out heat dissipation to the middle part.

Description

technical field [0001] The present invention relates to heat sinks, and more particularly to heat sinks with inclined dual-fan designs. Background technique [0002] With the rapid development of science and technology, computers or their display cards have widely used high-performance integrated circuits, such as: central processing unit (Central Processing Unit, CPU) or image processor (Graphic Processing Unit, GPU), etc., but the integrated circuit When various calculations are performed, a large amount of heat energy is generated, therefore, an auxiliary cooling device is required to dissipate heat from the integrated circuit. [0003] Most of these cooling devices currently adopt a dual-fan design, such as Taiwan patents No. 587769, 200644780, 545104, 577582, 200410626, 592347, and M245506. Wherein, the heat dissipation devices disclosed in the No. 592347 and No. M245506 patents also mention that one or both of the two fans are set to be inclined. [0004] Figure 4 sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467G06F1/20
Inventor 黄顺治毛黛娟
Owner GIGA BYTE TECH CO LTD