Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of hot plug method and mtca platform based on mtca platform

A hot-swap, platform technology, applied in the computer field, can solve the problem of not being able to achieve hot-swap and so on

Active Publication Date: 2016-05-04
EVOC SMART IOT TECH CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the embodiments of the present invention is to provide a hot-swapping method based on the MTCA platform, aiming to solve the problem that the existing MTCA platform can only realize basic hot-swapping, but cannot realize complete hot-swapping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of hot plug method and mtca platform based on mtca platform
  • A kind of hot plug method and mtca platform based on mtca platform
  • A kind of hot plug method and mtca platform based on mtca platform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. The embodiment of the present invention modifies the carrier board manager of the carrier board switch (MicroTCACarrierHub, MCH) and the baseboard management controller (BaseManagementController, BMC) on the system board of the existing MTCA platform, and adds a hot-swap driver, Enables MTCA platforms to support full hot-plugging.

[0033] In standard MTCA system structure, system board (CPUBoard) is regarded as a common AMC card, for convenience of description, the embodiment of the present invention provides the simplified structure of MTCA platform, as figure 1 As shown, there is a special des...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is applied to the field of computers, which provides a hot swapping method based on multiple terminal communication adapter (MTCA) platform and a multiple terminal communication adapter (MTCA) platform. The method comprises the following steps: allocating hot swapping control orders; allocating a hot swapping drive on a master operating system of a system board, wherein the hot swapping drive is based on intelligent platform management interface (IPMI) standard and used for analyzing received hot swapping control orders; generating hot swapping event-driven signals and executing hot swapping operation of a module; and achieving full hot swapping of the module between a machine check handler (MCH) of a loading board swapper and the hot swapping drive through hot swapping action parameters carried by the hot swapping control orders and data of a bus link of a back board of the module. The loading board swapper of the MCH and a block multiplexer channel (BMC) are modified based on a standard power-on flow and a standard power-off flow specified by automatic message counting (AMC) standard and the MTCA standard, and the hot swapping drive is added, thereby enabling the MTCA platform to support the full hot swapping and the MCH and the system board to be compatible with other platforms which do not support the full hot swapping.

Description

technical field [0001] The invention belongs to the field of computers, in particular to an MTCA platform-based hot plugging method and the MTCA platform. Background technique [0002] In the specification PICMG2.1R2.0-Hot Swap Specification (HotSwapSpecification) of PCI Industrial Computer Manufacturers Group (PCI Industrial Computer Manufacturers Group, PICMG), the description of hot plug processing is divided into physical connection (Physical connection), hardware connection (Hardware connection) and software Connection (Softwareconnection) three connection stages. [0003] In a system, hot-swappable components include a board (Board), a system board (SystemHost) and a platform (Platform). Boards other than the system board can be classified into three hot-swappable types: non-hot-swappable, basic hot-swappable, and full hot-swappable. Basic hot-swappable boards have only the minimum features required for hot-swap. [0004] Platforms are also divided into three types:...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/40
Inventor 陈志列朱学朋贺才望
Owner EVOC SMART IOT TECH CO LTD