Method and apparatus for depositing a film using a rotating source

Abstract

The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light- Emitting Diode (''OLED''). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).

Description

[0001] This application claims priority to Provisional Application Serial No. 61 / 283,011, filed November 27, 2009, and Application Serial No. 12 / 139,404, filed June 13, 2008, which claims June 2007 Priority of provisional application No. 60 / 944,000 filed on the 14th. The entire disclosure of the above application is hereby incorporated by reference. technical field [0002] The present disclosure generally relates to a method and apparatus for depositing a substantially solid thin film onto a substrate. More specifically, the present disclosure relates to a novel method of printing organic light emitting diode ("OLED") thin films using a rotating source. Background technique [0003] When printing electronic films, it is important that a dry film is deposited onto the surface such that the material being deposited forms a substantially solid film when in contact with the substrate. This is in contrast to ink printing where wet ink is deposited onto a surface and the ink th...

AI Technical Summary

Problems solved by technology

Second, wetted inks may interact with the underlying substrate

In addition, the traditional dry transfer technology only utilizes a part of the material on the transfer medium, resulting in low material utilization and considerable waste

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