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Panel structure of chip on film

A chip-on-film and panel technology, applied in printed circuits, electrical components, climate sustainability, etc., can solve the problems of increasing the length of the fan-out area, not easy to narrow the panel frame, and occupying the space available for the fan-out leads.

Active Publication Date: 2014-05-21
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

[0004] The object of the present invention is to provide a chip-on-chip panel structure with an lead-out area of ​​an array lead, to solve the problem that the array lead will occupy the available space of the fan-out lead and the array lead makes the fan-out of the existing chip-on-film panel structure The increase in the length of the area makes it difficult to realize the technical problem of narrowing the panel frame

Method used

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  • Panel structure of chip on film
  • Panel structure of chip on film
  • Panel structure of chip on film

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Embodiment Construction

[0020] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. In the figures, structurally similar units are denoted by the same reference numerals.

[0021] figure 2 It is a structural schematic diagram of the first preferred embodiment of the panel structure of the chip-on-film of the present invention, and the panel structure of the chip-on-film includes a panel body 200 and a fan-out lead 210 arranged on the panel body 200 for connecting the fan-out lead The first metal sheet 220 of 210, the array lead 230 and the second metal sheet 240 for connecting the array lead 230, the array lead 230 is located on both sides of the fan-out lead 210, the second metal sheet 240 is located on both sides of the first metal sheet 220 side, wherein the length of the second metal sheet 240 is smaller than the length of the first metal sheet 220 to form an extraction region...

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Abstract

A panel structure of a chip on film comprises a panel body (200) and a fanout lead (210) arranged on the panel body (200), a first metal piece (220), an array lead (230), and a second metal piece (240). The array lead (230) is located at two sides of the fanout lead (210). The second metal piece (240) is located at two sides of the first metal piece (220). The length of the second metal piece (240) is smaller than that of the first metal piece (220) so as to form a lead-out area (250). The array lead (230) is led out of the second metal piece (240) through the lead-out area (250). The lead-out area (250) of the array lead (230) is arranged in the panel structure of the chip on film. The array lead (230) does not occupy any available space of the fanout lead (210), and does not add the length of the fanout lead (210), thereby narrowing the frame of the panel.

Description

technical field [0001] The invention relates to the field of panel structure design, in particular to a panel structure of a chip-on-chip film with an lead-out area of ​​an array lead. Background technique [0002] Currently, there are two types of OLB (Out Leader Bonding: Output Lead Bonding) technologies commonly used in the liquid crystal display industry: COF (Chip on Film: Chip-on-Film) and COG (Chip on Glass: Chip-on-Glass). Usually, if the OLB technology adopts the COF method, when the fanout (fanout) leads 110 are arranged in the early stage of the panel structure design, it is usually necessary to reserve a large space at both ends of the panel adopting the COF type (the experience value is 2mm), to configure the array leads 130 (such as figure 1 shown). but figure 1 The arrangement of the array leads 130 shown on the one hand will occupy the available space of the fan-out leads 110 , and on the other hand will increase the length of the area of ​​the fan-out lea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L23/488
CPCH05K2201/10674H05K1/0296H01L23/4985H01L2924/0002H05K1/111H05K2201/094H05K2201/09227Y02P70/50H01L2924/00
Inventor 施明宏李蒙
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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