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Piezoelectric vibrator element, piezoelectric module, and electronic device

A technology of piezoelectric vibrating piece and vibrating part, which is applied to electrical components, impedance networks, etc., and can solve problems such as lack of strength and lack of practicability

Inactive Publication Date: 2012-07-11
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the structure supporting the vibrating part 706 only by the connection part 710, there is a problem of lack of strength against falling impacts and the like, and there are problems such as lack of practicality

Method used

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  • Piezoelectric vibrator element, piezoelectric module, and electronic device
  • Piezoelectric vibrator element, piezoelectric module, and electronic device
  • Piezoelectric vibrator element, piezoelectric module, and electronic device

Examples

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Embodiment Construction

[0086] Hereinafter, the present invention will be described in detail using the illustrated embodiments. However, unless the structural elements, types, combinations, shapes, relative arrangements, etc. described in this embodiment are not specifically described, the scope of the present invention is not limited thereto, and are merely illustrative examples. In addition, in the drawings used in the following description, the X axis, the Y' axis, and the Z' axis are perpendicular to each other.

[0087] exist Figure 1(a) to Figure 1(c) , Figure 2(a) to Figure 2(c) The piezoelectric vibrating reed according to the first embodiment is shown in FIG. Fig. 1 (a) is a top view, Fig. 1 (b) is a bottom view, Fig. 1 (c) is a figure representing the cutting angle of the crystal substrate, Fig. 2 (a) is a front view, and Fig. 2 (b) is a rear view, Fig. 2(c) is a sectional view along line A-A in Fig. 1(a). The piezoelectric vibrating reed 10 according to the present embodiment adopts...

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PUM

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Abstract

The invention relates to a piezoelectric vibrator element, a piezoelectric module, and an electronic device. The piezoelectric vibrator element (10) includes a vibrating portion (22) that excites thickness-shear vibration, and a peripheral portion (17) that is disposed on the periphery of the vibrating portion and has a thickness thinner than the vibrating portion (22), the vibrating portion and the peripheral portion being formed in a piezoelectric substrate. A buffering portion (14) and a mount portion (12) are sequentially connected to the peripheral portion (17). The buffering portion (14) includes a slit (16) formed between the mount portion (12) and the peripheral portion (17). The mount portion (12) has notches (12a) which are formed at both end portions in a direction orthogonal to an arrangement direction of the mount portion (12), the buffering portion (14), and the peripheral portion (17).

Description

technical field [0001] The present invention relates to a piezoelectric vibrating reed and a piezoelectric module using the piezoelectric vibrating reed, and more particularly to a technique capable of alleviating the influence of stress at a mounting position generated after mounting on a vibrating part. Background technique [0002] Conventionally, the piezoelectric vibrating reed has been mounted on a package by applying a conductive adhesive. In this way, in the heat treatment process such as drying for curing the conductive adhesive, the deformation due to the different linear expansion coefficients of the piezoelectric vibrating reed, package, and conductive adhesive , will remain in the bonded portion of the cooled conductive adhesive, and there is a problem that the stress from the bonded portion to the vibrating portion, that is, thermal deformation will adversely affect the vibration. [0003] Furthermore, when miniaturization of the piezoelectric vibrating piece ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H3/02H10N30/88
CPCH03H9/0519H03H9/0547H03H9/19H03H9/0509H03H9/02023H03H9/02133H03H9/0552H03H9/1021
Inventor 草野淳
Owner SEIKO EPSON CORP