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Datacommunications/telecommunications patching systems with integrated connectivity module

A technology for connecting wires, telecommunications, applied in the field of high density copper and fiber optic wiring devices, which can solve problems such as hindering cable management practice, increase

Inactive Publication Date: 2012-08-15
COMMSCOPE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increased density can prevent ideal cable management practices, and the reduction in usable volume (such as in 0U cabinets) can make cable management more critical

Method used

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  • Datacommunications/telecommunications patching systems with integrated connectivity module
  • Datacommunications/telecommunications patching systems with integrated connectivity module
  • Datacommunications/telecommunications patching systems with integrated connectivity module

Examples

Experimental program
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Embodiment Construction

[0028] The present invention will be described in more detail hereinafter with reference to the accompanying drawings. It is not intended that the invention be limited to the illustrated embodiments; rather, these embodiments are intended to fully and completely disclose the invention to those skilled in the art. Like reference numerals refer to like elements throughout the drawings. Thicknesses and dimensions of some components may be exaggerated for clarity. Well-known functions or constructions may not be described in detail for brevity and / or clarity.

[0029] Unless otherwise defined, all terms (including scientific and technical terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should be further understood that terms, such as those defined in commonly used dictionaries, should be understood to have a meaning consistent with their meaning in the context of the relevant art, and should ...

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PUM

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Abstract

A module adapted for use with a datacommunications equipment mounting structure includes: a generally upright divider panel; a cover panel disposed generally parallel to the divider panel, the cover panel and divider panel being spaced apart from each other to form a gap; and a plurality of telecommunications cables, each of the telecommunications cables comprising a plurality of telecommunications patch cords, the cables comprising bundled patch cords at a first end and unbundled patch cords at a second opposite end, the cables being positioned in the gap between the divider panel and cover panel. The bundled patch cords at the cable first end include first interconnection terminals, and the unbundled patch cords at the second end include second interconnection terminals. The first terminals are located at first edges of the divider and cover panels. The unbundled patch cords are separately moveable between a stored position, in which the second terminals are located at second edges of the divider and cover panels, and an extended position, in which the second terminals are positioned away from the second edges of the divider and cover panels.

Description

[0001] related application [0002] This application claims priority to U.S. Provisional Application No. 61 / 237,002, filed August 26, 2009, and U.S. Provisional Application No. 61 / 267,577, filed December 8, 2009, whereby each of these two applications The disclosure of one is incorporated in its entirety. technical field [0003] This invention relates generally to datacom / telecommunication equipment, and more particularly to high density copper and fiber optic distribution arrangements. Background technique [0004] In the datacom / telecom industry, the use of fiber optic cables to carry transmission signals is growing rapidly and continuously. To interconnect communication equipment such as servers, routers, and switches, fiber optic equipment, fiber distribution frames, racks, and cabinets have been developed. Such distribution frames, racks, and cabinets are typically located in telecommunications closets, data rooms, data centers, etc., where technicians can easily con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/44
CPCH04Q1/06H05K7/1491G02B6/4453G02B6/44526G02B6/44528G02B6/4452H02G3/081H05K7/1485H05K7/186
Inventor M·鲍尔达萨诺D·贝霍夫E·G·海兰德S·基思E·C·皮肯斯A·T·斯托特杨映林T·W·安德森
Owner COMMSCOPE INC
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