Fluid distribution manifold including compliant plates

Abstract

A fluid distribution manifold includes a first plate and a second plate. The first plate includes a length dimension, a width dimension, and a thickness that allows the first plate to be deformable over at least one of the length dimension and the width dimension of the first plate. The second plate includes a length dimension, a width dimension, and a thickness that allows the second plate to be deformable over at least one of the length dimension and the width dimension of the second plate. At least a portion of at least the first plate and the second plate define a relief pattern that defines a fluid flow directing path. The first plate and the second plate are bonded together to form a non-planar shape in a height dimension along at least one of the length dimension and the width dimension.

Description

technical field [0001] The present invention relates generally to the diffusion flow of gaseous or liquid materials, especially during the deposition of thin film materials, and more particularly to apparatus for atomic layer deposition using a dispensing or delivery head to direct a simultaneous flow of gas onto a substrate. on the substrate. Background technique [0002] Among the techniques widely used for thin film deposition include chemical vapor deposition (CVD), which uses chemically active molecules reacting in a reaction chamber to deposit a desired thin film on a substrate. Molecular precursors useful for CVD applications contain the elemental (atomic) composition of the thin film to be deposited, typically also including other elements. CVD precursors are volatile molecules that are delivered into the chamber in a gaseous state to react on the substrate to form a thin film thereon. The chemical reaction deposits a film with the desired film thickness. [0003]...

AI Technical Summary

Problems solved by technology

The composite arrangement of the airflow delivery unit of the '563 Yudovsky patent and the airflow array of the '022 Suntola et al. patent, each providing airflow and vacuum, both make the solution difficult to implement, expensive, and limit its use on moving substrates of limited size Potential usability of deposition applications

Also, it is very difficult to maintain a uniform vacuum at different points in the array and synchronized airflow and vacuum at supplemental pressure, thus compromising the uniformity of airflow provided to the substrate surface

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