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Reactive purge compound for polymer purging

一种聚合物、化合物的技术，应用在清洗化合物领域，能够解决非均匀色、聚合物脱色等问题

Inactive Publication Date: 2012-10-03
MSI TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, some of the polymers produced using a process that includes a step of processing the polymer through processing equipment may be discolored, have non-uniform coloring (e.g., dark spots), or have defects due to changes in flow characteristics

Method used

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  • Reactive purge compound for polymer purging
  • Reactive purge compound for polymer purging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] First, an aqueous solution of sodium hydroxide was sprayed onto pellets of low-density polyethylene (Petrothene® NA960000 purchased from Equistar Chemicals, and measured at 190° C. / 2.16 kg according to ASTM D1238-04 to have a melt of about 0.8 g / 10 min flow rate) to prepare the cleaning compound such that the ratio of low density polyethylene to sodium hydroxide is about 99:1 when drying the coated pellets. The low density polyethylene (LDPE) was dried at about 100°C for about 16 hours to remove water before extrusion. The coated pellets containing LDPE and sodium hydroxide were melt compounded on a Killion single screw extruder with a screw diameter of about 31.75 mm and a length / diameter ratio (L / D) of about 24:1. The extruder was equipped with a barrel extension (304.8 mm long) to accommodate the screw chopper section (such as the one disclosed in US Patent 6,062,717, incorporated herein by reference) and to enhance mixing and dispersion . Including barrel extensio...

Embodiment 2

[0093] Example 2 was prepared and evaluated using the same materials and methods as described in Example 1, except that about 1 wt.% KOH was used instead of 1 wt.% NaOH as the chain scission catalyst.

Embodiment 3

[0095] Except 1wt.% anhydrous potassium carbonate (K 2 CO 3 ), Example 3 included the first portion of the cleaning compound prepared and evaluated using the same materials and methods as described in Example 1. Example 3 was then prepared by dry blending the first part of the purge compound with Polyfil SBC-4000 (sodium bicarbonate concentrate in a thermoplastic containing polyolefin carrier resin) at a rate of about 97 wt.% to about 3 wt.%. The concentration of sodium bicarbonate in Example 3 was about 1.2 wt.%, based on the total weight of the cleaning compound.

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Abstract

The present invention relates to reactive purge compound for cleaning polymer processing equipment wherein the reactive purge compound that includes at least about 50 wt.% of a polymeric carrier component based on the total weight of the reactive purge compound, wherein the polymeric carrier component includes one or more polymers; a chain scission catalyst component dispersed in the polymeric carrier component; and iii) a water generating component; wherein the reactive purge compound is a feedstock material in the form of a plurality of pellets, granules, rods, powder or other particles.

Description

[0001] priority claim [0002] This application claims the benefit of US Patent Application Serial No. 12 / 502,556 (filed July 14, 2009), which is hereby incorporated by reference herein in its entirety. technical field [0003] The present invention generally relates to cleaning compounds for cleaning polymer processing equipment, and methods of cleaning polymer processing equipment, said cleaning compounds comprising a polymeric carrier component (polymeric carrier component), a chain scission catalyst component and optionally a component Water generating component. Background technique [0004] Processing of polymers, especially polymers that are polar and / or have an affinity for metal surfaces when molten, can cause the polymer to be trapped in polymer processing equipment (e.g., on a screw or barrel such as an extruder). , or buildup in molds, adapters, or other parts of processing equipment). Over time, polymer buildup can cause polymers to be exposed to heat for ext...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C47/08B29C48/27B29C48/04
CPCB29C47/0011B29C2947/92704B29C2947/92038B29C2947/922B29C2947/9219B29C2947/924B29C2947/9259B29C2947/92885B29C2947/92209B29C2947/92104B29C2947/9239B29C47/0877B29C2947/92695B29C2948/92209B29C2948/924B29C2948/92704B29C48/04B29C48/27B29C2948/92038B29C2948/92104B29C2948/9219B29C2948/922B29C2948/9239B29C2948/9259B29C2948/92695B29C2948/92885
Inventor 志田光三W-L·A·陈
Owner MSI TECH LLC
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