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Method for preparing beryllium-copper alloy sheet by adopting continuous magnetron sputtering physical-vapor deposition method

A technology of physical vapor deposition and magnetron sputtering, which is applied in sputtering coating, metal material coating process, ion implantation coating, etc. Low efficiency and other problems, to achieve the effect of high product yield, flexible and controllable beryllium content, and low manufacturing cost

Active Publication Date: 2014-01-22
兰州大成科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the technical difficulty of rolling beryllium copper alloy is high, and the yield and production efficiency are low.
Moreover, beryllium copper alloys are smelted in an atmospheric environment, and there are disadvantages such as beryllium metal polluting the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: A method for preparing Cu-1~3wt.%Be alloy thin plate by continuous magnetron sputtering physical vapor deposition, the steps are:

[0025] Step 1. Select a pure copper strip with a thickness of 0.1-0.25mm as the substrate, and do the following pretreatment:

[0026] (1) Wash with sodium carbonate lye at a concentration of 3-5% and a temperature of 60-80°C for 3-5 minutes to remove oil stains;

[0027] (2) Wash with dilute sulfuric acid at a concentration of 3 to 5% for 3 to 5 minutes to remove scale;

[0028] (3) Rinse with clean water;

[0029] (4) Ultrasonic cleaning with anhydrous ethanol, drying for later use;

[0030] Step 2. Select pure Be target or high beryllium content beryllium copper (50 ~ 80wt.%Be) alloy target:

[0031] preparation Circular or 1000~1500mm×180~300mm×6~20mm square pure Be or high beryllium content beryllium copper 50~80wt.% Be alloy target is used as magnetron sputtering target, ready for use;

[0032] (3). Install the p...

Embodiment 2

[0046] Example 2 Magnetron sputtering vapor deposition single-sided Be infiltration

[0047] Step 1: Select pure copper substrate

[0048] Select a 200mm×200mm, 0.20mm thick pure copper strip as the substrate, first wash it with 5% sodium carbonate lye at a temperature of 60°C for 5 minutes to remove oil stains; then wash it with 4% dilute hydrochloric acid for 3 minutes to remove Oxidized skin; then rinse with clean water; then use absolute ethanol to ultrasonically clean, dry and set aside.

[0049] Step 2: Select pure Be target

[0050] preparation The circular pure Be target is used as the magnetron sputtering target, for use;

[0051] (3). Install the pure copper strip treated in step (1) on the substrate stage of the magnetron sputtering equipment as the anode; then put the pure Be target in step 2 into the magnetron sputtering target holder as the cathode;

[0052] Vacuum to 1.2×10 -3 After Pa, feed argon to stabilize the pressure in the magnetron sputtering coat...

Embodiment 3

[0059] Example 3 Magnetron sputtering vapor deposition single-sided Be infiltration

[0060] Step 1: Select pure copper substrate

[0061] Select a 1000mm×200mm, 0.15mm thick pure copper strip as the substrate, first wash it with a sodium carbonate solution with a concentration of 5% and a temperature of 60°C for 5 minutes to remove oil stains; then wash it with dilute hydrochloric acid with a concentration of 4% for 3 minutes to remove oxidation skin; then rinse with clean water; then ultrasonically clean with anhydrous ethanol, and dry for later use.

[0062] Step 2: Select a beryllium copper alloy target with high Be content

[0063] Melting and casting 1200mm×200mm×15mm high Be content beryllium copper (Cu-80wt.%Be) alloy target, ready for use;

[0064] Step 3: Install the pure copper strip processed in step 1 on the substrate of the magnetron sputtering film machine as an anode; then put the beryllium copper alloy target processed in step 2 into the magnetron sputtering...

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Abstract

The invention relates to a method for preparing a beryllium-copper alloy sheet, and particularly relates to a method for preparing the beryllium-copper alloy sheet by adopting a continuous magnetron sputtering physical-vapor deposition method. The method for preparing the beryllium-copper alloy sheet by adopting the continuous magnetron sputtering physical-vapor deposition method comprises the following steps: depositing a pure Be or Be-rich membrane with good combination on the single surface or both surfaces of a pure copper strip by taking a pure Be metal target or a beryllium-copper alloy target with high beryllium content as a cathode and the pure copper strip as an anode and adopting the magnetron sputtering physical-vapor deposition method; and then carrying out diffusion treatment at high temperature to enable Be atoms to be diffused inwards and permeated into a pure copper base body till the content of Be contained in the pure copper strip reaches 1-3 percent by weight so as to obtain a Cu-Be alloy strip, which is excellent in mechanical property and conductive property, with the Be content of 1-3 percent by weight. The method disclosed by the invention has the advantages of simplicity, easiness for operation, high work efficiency, energy-saving and environment-friendly preparation process, controllable quality and great suitability for industrialized application.

Description

technical field [0001] The present invention relates to a method for preparing a beryllium-copper alloy sheet, more particularly, a method for preparing a high-performance Cu-1-3wt.%Be alloy sheet by continuous magnetron sputtering physical vapor deposition. Background technique [0002] Beryllium-copper alloy is a typical precipitation-strengthened alloy, which has a series of advantages such as high elasticity, high strength, high conductivity, corrosion resistance, fatigue resistance, small elastic hysteresis, non-magnetism, and no sparks during impact. It is widely used It is used in aerospace, aviation, electronics, communication, machinery, petroleum, chemical industry, automobile and home appliance industries, and has broad application prospects. [0003] At present, beryllium-copper alloy sheets and strips are basically prepared by rolling method, mainly including semi-continuous casting ingot + milling skin + heating + rough rolling + quenching + secondary rolling +...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/16
Inventor 范多进田广科范多旺陈虎孔令刚马海林孙勇
Owner 兰州大成科技股份有限公司
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