Rigid-flex printed circuit board manufacturing method
A technology of printed circuit board and manufacturing method, applied in the field of PCB board manufacturing, can solve the problems of low production efficiency, high production cost, large difference in expansion and the like
Inactive Publication Date: 2015-09-09
深圳华祥荣正电子有限公司
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Problems solved by technology
However, the layer-by-layer and step-by-step lamination method has the disadvantages of: (1) the production steps take a long time and the production cost is high
(2) Layer-by-layer and step-by-step lamination method, the thermal expansion coefficient of each lamination is different, and the drilling belt must be adjusted to be consistent with the thermal expansion coefficient of the pressing each time in the subsequent drilling to produce, and the production efficiency is low
(3) Layer-by-layer and step-by-step lamination method, when the thermal expansion coefficient of the laminated board material is subjected to thermal shock, the expansion in the Z direction is very different from the expansion of copper, so it is very easy to cause the fracture of the metallized hole
Method used
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Embodiment 1
[0041] A first flexible board and a second flexible board are provided, each surface of the first flexible board and the second flexible board includes a window area and an adhesive area, and the window area is located between the first flexible board and the second flexible board. In the middle of the board surface, the bonding area is located at both ends of the first flexible board and the second flexible board surface, and a cover layer is bonded on the window area, and the edge of the cover layer enters the bonding area by 0.3mm.
[0042] A first rigid plate, a second rigid plate, a third rigid plate, a fourth rigid plate, a fifth rigid plate and a sixth rigid plate are provided.
[0043] A first no-flow epoxy prepreg, a second no-flow epoxy prepreg, a third no-flow epoxy prepreg, and a fourth no-flow epoxy prepreg were provided.
[0044] Provide the first flow epoxy prepreg, the second flow epoxy prepreg and the third flow epoxy prepreg, wherein the glue flow rate of the...
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The invention provides a manufacturing method of a rigid-flex combined printed circuit board. The manufacturing method includes the following steps: providing a flexible plate; providing rigid plates; providing stagnant epoxy prepregs; providing flow epoxy prepregs; sequentially stacking a rigid plate, a flow epoxy prepreg, a rigid plate, a stagnant epoxy prepreg, the flexible plate, a stagnant epoxy prepreg, a rigid plate, a flow epoxy prepreg and a rigid plate, and performing combination and lamination; and sequentially performing the steps of drilling, copper electroless plating, panel plating, graphing, solder resisting, surface processing, uncapping, edge milling, electrical logging, appearance testing and packaging to form the rigid-flex combined printed circuit board. The manufacturing method of the rigid-flex combined printed circuit board adopts a once lamination method to enable the flexible plate, the rigid plates, the stagnant epoxy prepregs and the flow epoxy prepregs to be laminiated together, shortens machining time of manufacturing steps of the rigid-flex combined printed circuit board, and reduces production cost.
Description
technical field [0001] The invention relates to the field of PCB board manufacture, in particular to a method for manufacturing a rigid-flexible printed circuit board. Background technique [0002] In recent years, with the rapid growth of consumer electronics products, such as mobile phones, laptop computers, digital cameras, digital cameras, VCD, DVD, miniature tape recorders, pickups and fitness monitors, printed circuit boards continue to move towards high-density, The development in the direction of high precision, high reliability, large area, thin line and small aperture has led to a single rigid printed board or flexible printed board that can no longer meet the requirements of miniaturization, light weight and multi-functionality of electronic products. So there is a rigid-flexible printed circuit board. Multilayer Rigid-Flex Printed Circuit Board (Rigid-Flex Printed Circuit Board), which is selectively laminated by rigid and flexible substrates, and is formed by m...
Claims
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IPC IPC(8): H05K3/36
Inventor 姚国庆
Owner 深圳华祥荣正电子有限公司