Removing and segregating components from printed circuit boards

A technology for printed circuit boards and components, applied in the direction of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of time-consuming and difficult removal and separation

Inactive Publication Date: 2013-04-17
EMPIRE TECH DEV LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Removing and separating materials from e-waste can be time-consuming and difficult

Method used

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  • Removing and segregating components from printed circuit boards
  • Removing and segregating components from printed circuit boards
  • Removing and segregating components from printed circuit boards

Examples

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Embodiment Construction

[0018] The following description sets forth various examples and specific details to provide a thorough understanding of the claimed subject matter. It will be understood, however, by those skilled in the art that claimed subject matter may be practiced without some or more of the specific details disclosed herein. Moreover, in some instances, well-known methods, procedures, systems, components and / or circuits have not been described in detail in order to avoid unnecessarily obscuring claimed subject matter.

[0019] In the following detailed description, reference is made to the accompanying drawings which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The exemplary embodiments described in the detailed description, drawings, and claims are not limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented he...

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Abstract

A method for removing components from a printed circuit board by securing the printed circuit board and directing air onto the surface of the printed circuit board using a parameter such that the directed air source removes the a first component from the printed circuit board and leaves the second component intact. Additionally, a system and article comprising a computer program product for removing components from a printed circuit board using the above method is disclosed.

Description

Background technique [0001] Unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section. [0002] Waste from the electronics industry includes mixtures of materials such as plastics, metals, ceramics, fiberglass, precious metals, toxic materials, and others. Removing and separating materials from e-waste can be time-consuming and difficult. Contents of the invention [0003] According to some implementations, a method for removing components from a printed circuit board includes securing the printed circuit board, directing air with a directional air source onto a surface of the printed circuit board to remove components from the printed circuit board, and collecting the components. [0004] According to some implementations, a system configured to remove components from a printed circuit board may include an assembly configured to hold a pri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00H05K3/00
CPCB23K1/018H05K13/0486Y10T156/1911Y10T29/53274Y10T156/19Y10T29/49821Y10T156/1153Y10T29/49819Y10T156/1137Y10T29/5137Y10T156/1939
Inventor 马克·梅洛尼
Owner EMPIRE TECH DEV LLC
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