Hot solidification type component used for filling printed circuit board punched hole
A printed circuit board, thermal curing technology, applied in the direction of the electrical connection of printed components, etc., can solve the problems of difficult processing, general products without suitable structure, and inability to fully take into account the combination and mechanical properties
Inactive Publication Date: 2013-06-05
FEMTO TECH CO LTD
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- Application Information
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Problems solved by technology
However, this patent publication uses epoxy resin with at least three functional groups to cure quickly, shrink greatly, and is not easy to process
[0007] From the above, it can be seen that the thermosetting resin composition used to fill the through-holes of the printed circuit board cannot fully meet the processing requirements such as bonding with the substrate of the printed circuit board, mechanical properties, and avoiding cracks after being heated and cured. Therefore, the industry still hopes to continuously improve the properties of thermosetting resin compositions to meet the above-mentioned requirements
[0008] It can be seen that the above-mentioned existing thermosetting composition for filling printed circuit board perforations obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem
Method used
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Examples
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Effect test
Synthetic example
[0046] [Synthetic reactive rubber]
[0047] The synthetic steps of reactive rubber are as follows:
[0048] (1) 10g of carboxy-terminated nitrile rubber and 20g of 4,4'-diaminodicyclohexylmethane were dissolved in 60mL of xylene to obtain a mixed solution.
[0049] (2) The mixture was heated to 110° C. under stirring, and reacted for 3 hours to obtain a reactive rubber.
[0050] (3) After the reactive rubber is cooled, confirm the carboxyl absorption peak (3300cm -1 Nearby OH broad absorption), and the disappearance of the amide bond (3300cm -1 The generation of elongated NH peak absorption nearby).
Embodiment 1
[0052] 45 g of bisphenol A diglycidyl ether oligomer, 5 g of poly(oxyethylene) diamine, 5 g of the reactive rubber of the synthesis example, and 11 g of calcium carbonate particles were fully kneaded to obtain thermosetting composition a1.
Embodiment 2
[0054] After fully kneading 30g of bisphenol A diglycidyl ether oligomer, 18g of poly(oxyethylene) diamine, 10g of the reactive rubber of the synthesis example and 23.2g of calcium carbonate particles, a thermosetting composition a2 is obtained
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The invention relates to a hot solidification type component used for filling a printed circuit board punched hole. The hot solidification type component used for filling the printed circuit board punched hole comprises a reactivity component, curing agents, reaction type rubber and inorganic particles. The reactivity component comprises at least one monomer or one oligomer of an epoxy group. The reaction type rubber comprises at least one functional group which can react with the reactivity component or the curing agents. The invention further provides method of filling the printed circuit board punched hole. The method of filling the printed circuit board punched hole includes the following steps: full filling the hot solidification type component used for filling the printed circuit board punched hole into the punched hole, and heating and solidifying the heat solidification type component in the punched hole. The hot solidification type component possesses good associative property and is capable of avoiding a cracking phenomenon after being solidified.
Description
technical field [0001] The present invention relates to a thermosetting composition, in particular to a thermosetting composition for filling the perforation of a printed circuit board, and a method for filling the perforation of the printed circuit board. Background technique [0002] With the advancement of technology, the number of laminated printed circuit substrates is also increasing. In the process, after the substrate is perforated and the circuit is turned on, the holes are filled to facilitate the subsequent circuit layout. [0003] Existing hole filling technology, such as Japanese Patent Application Laid-Open No. 2001-015909, discloses a method for flattening a printed circuit board with a thermosetting resin, which is to fill the holes on the substrate with a thermosetting resin, and then grind the The surface is flat. However, this process will increase the processing steps and the cost of grinding, and easily cause the deformation of the circuit size. [000...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08L63/00C08L63/02C08L15/00C08K3/26C08K5/5425C08K3/36C08G59/22C08G59/50H05K3/40
Inventor刘瑞祥
OwnerFEMTO TECH CO LTD