Heat dissipation structure and electronic device with same

Abstract

Provided are a heat dissipation structure and an electronic device with the same. The electronic device comprises a circuit board, a plurality of electronic elements, the heat dissipation structure and a shell. The electronic elements are electrically arranged on the circuit board, and the heat dissipation structure comprises a first insulation heat-conductive layer and a metal layer. The first insulation heat-conductive layer wraps the circuit board or / and the electronic elements. The coefficient of thermal conduction of the first insulation heat-conductive layer is larger than 0.5W / m.K, and the metal layer is combined and heat-contacted with the first insulation heat-conductive layer. An accommodating space is arranged in the shell, and the circuit board, the electronic elements and the heat dissipation structure are accommodated in the accommodating space. Moreover, the metal layer is arranged between the shell and the first insulation heat-conductive layer.

Description

technical field [0001] The present invention relates to a heat dissipation structure, in particular to a heat dissipation structure capable of uniforming the temperature distribution on the surface of an electronic device and rapidly reducing the temperature of internal high-heat electronic components, and an electronic device with the heat dissipation structure. Background technique [0002] Power adapters and power supplies are indispensable electronic devices for the operation of various electrical equipment. These electronic devices have many electronic components on their internal circuit boards, and these electronic components include not only high heating power components (such as transformers, metal oxide semiconductor field effect transistors, diodes, inductors, etc.) but also low heating power components (such as capacitor or resistor). When the electronic device is in operation, if the heat generated by these electronic components cannot be effectively removed fr...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the above problems of uneven temperature distribution of the housing of the electronic device, excessively high temperature of the electronic components in the electronic device, and limited internal space, the present invention proposes an effective heat dissipation device that can be flexibly designed and used depending on the heat dissipation requirements. Heat dissipation structure and electronic device with the heat dissipation structure

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