Non-volatile storage element and non-volatile storage device
A non-volatile storage and memory cell technology, applied in electrical components, information storage, static memory, etc., can solve the problems of increased resistance change layer deviation and resistance change characteristic deviation, and achieve the resistance change characteristic deviation. small effect
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Embodiment approach 1
[0069] [Structure of nonvolatile memory element]
[0070] figure 1 It is a cross-sectional view showing a configuration example of the nonvolatile memory element according to Embodiment 1 of the present invention.
[0071] The nonvolatile memory element 100 of this embodiment includes: a substrate 101, an interlayer insulating film 102 formed on the substrate 101, a first electrode 103 formed on the interlayer insulating film 102, a second electrode 106, and a The variable resistance layer 104 sandwiched between the first electrode 103 and the second electrode 106 .
[0072] The variable resistance layer 104 is composed of a metal oxide (metal oxide) sandwiched between the first electrode 103 and the second electrode 106, and the resistance value can be changed according to the voltage applied between the first electrode 103 and the second electrode 106. signal to reversibly change layers. For example, the resistance state of the metal oxide of the variable resistance laye...
Embodiment approach 2
[0226] Figure 16 It is a cross-sectional view showing a configuration example of the variable resistance nonvolatile memory element 400 according to Embodiment 2 of the present invention.
[0227] figure 1 The shown variable resistance nonvolatile memory element 100 according to Embodiment 1 of the present invention and Figure 16 The nonvolatile memory element 400 differs in that each layer of the variable resistance layer is arranged upside down, and furthermore, the first electrode and the second electrode are arranged upside down. That is, while the second electrode 106 is arranged above the first electrode 103 in the nonvolatile memory element 100 , the second electrode 406 is arranged below the first electrode 403 in the nonvolatile memory element 400 .
[0228] The nonvolatile memory element 400 of this embodiment includes: a substrate 401, an interlayer insulating film 402 formed on the substrate 401, a second electrode 406 formed on the interlayer insulating film ...
Embodiment approach 3
[0242] Figure 18 It is a cross-sectional view showing a configuration example of the variable resistance nonvolatile memory element 500 according to Embodiment 3 of the present invention.
[0243] figure 1 The shown variable resistance nonvolatile memory element 100 according to Embodiment 1 of the present invention and Figure 18 The nonvolatile memory element 500 differs in that the partial region 105 is composed of a first partial region 105a and a second partial region 105b.
[0244] The nonvolatile memory element 500 includes a substrate 101 , an interlayer insulating film 102 , a first electrode 103 , a second electrode 106 , and a variable resistance layer 104 .
[0245] Here, the variable resistance layer 104 includes a first oxide layer 104 a , a second oxide layer 104 b , a third oxide layer 104 c and a partial region 105 . The resistivity ρ of the first oxide layer 104a x , The resistivity ρ of the second oxide layer 104b y , and the resistivity ρ of the thir...
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