Adhesive and application thereof as well as adhesive film component and application thereof

A technology of adhesive and adhesive film, which is applied in the field of optical glue, can solve the problem of bubbles on the edge of decorative ink, and achieve the effect of solving bubbles

Inactive Publication Date: 2013-10-23
NANCHANG O FILM TECH CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional OCA is a non-substrate double-sided adhesive in an adhesive state. When using OCA to bond the panel and the sensor circuit, it is easy to generate air bubbles at the edge of the decorative ink.

Method used

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  • Adhesive and application thereof as well as adhesive film component and application thereof
  • Adhesive and application thereof as well as adhesive film component and application thereof
  • Adhesive and application thereof as well as adhesive film component and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0074] figure 2 The preparation method of the electronic device shown is as follows: the surface printed with decorative ink 16 on the panel 18 is bonded to the sensor circuit 12 by using an adhesive or an adhesive film assembly, then heated and defoamed, and then hardened by ultraviolet light irradiation.

[0075] The temperature of the heating and defoaming treatment may be 40°C-80°C, the pressure may be 0.4Mpa-0.65Mpa, and the time may be 10min-60min. The purpose of heating defoaming treatment is to use vacuum defoaming technology to remove the air bubbles generated by bonding, and at the same time make the adhesive have a certain fluidity, which can fill the gap between the adherends, thereby removing air bubbles. The wavelength of ultraviolet light irradiated by ultraviolet light can be 200nm~400nm, and the energy can be 500mj / cm 2 ~5000mj / cm 2 . Hardening by ultraviolet light irradiation can harden the adhesive used for laminating the panel 18 and the sensor circuit ...

Embodiment 1

[0078] Add 50 g of polymethyl methacrylate, 29 g of ethyl acrylate and 1 g of quinone diazide into 20 g of tetrahydrofuran solution, and mix well to prepare Adhesive 1. Adhesive 1 is used to bond the panel and the sensor circuit, and the air bubbles in the adhesive 1 are removed under the conditions of 40° C. and a pressure of 0.65 MPa for 40 minutes. Next, use a wavelength of 365nm and an energy of 3000mj / cm 2 The ultraviolet light irradiates the adhesive to harden the adhesive 1. The product obtained after bonding the panel and the sensor circuit with Adhesive 1 has no air bubbles and has a smooth surface.

Embodiment 2

[0080] Add 80g polymethyl methacrylate, 10g ethyl ethacrylate and 3.8g diazonaphthoquinonesulfonyl chloride to 5g cyclohexanone, then add 0.5g p-methoxyphenol, 0.2g diisononyl phthalate Adhesive 2 was prepared after the ester and 0.5 g fatty acid ester were mixed uniformly. After bonding the panel and the sensor circuit with the adhesive 2, degassing treatment was performed at 80°C and a pressure of 0.6Mpa for 10 minutes to remove the air bubbles in the adhesive 2. Next, use a wavelength of 365nm and an energy of 500mj / cm 2 The ultraviolet light irradiates the adhesive to harden the adhesive 2. The product obtained after bonding the panel and the sensor circuit with adhesive 2 has no air bubbles and has a smooth surface.

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Abstract

The invention discloses an adhesive which comprises the following ingredients in percentage by weight: 50-80% of a high-molecule resin, 10-30% of an organic monomer, 5-20% of an organic solvent and 1-5% of a photosensitizer. The adhesive has certain mobility after being heated and softened, gaps among adhered articles can be sufficiently filled, through vacuum defoaming treatment, bubbles among the adhesive and the adhered articles are completely eliminated, furthermore through ultraviolet radiation, a transparent optical cement can be hardened, the bonding property of the adhesive is sufficiently realized, and gas molecules inside the hardened optical cement are unlikely aggregated to form visible aggregated bubbles, so that the problem of bubbles of an adhered component is effectively solved. In addition, the invention further provides an application of the adhesive, an adhesive film component and an application of the adhesive film component.

Description

technical field [0001] The invention relates to the field of optical glue, in particular to an adhesive and its application, an adhesive film component and its application. Background technique [0002] Currently, there are two types of adhesives used for bonding electronic devices: Optically Clear Adhesive (OCA for short) and Liquid Optically Clear Adhesive (LOCA for short). [0003] When the electronic device is bonded, especially when the panel and the sensor circuit are bonded, since the panel is printed with decorative ink, there is a gap in thickness between the frame of the panel and the window area. The traditional OCA is a non-substrate double-sided adhesive in an adhesive state. When using OCA to bond the panel and the sensor circuit, it is easy to generate air bubbles at the edge of the decorative ink. Contents of the invention [0004] Based on this, it is necessary to provide an adhesive that does not contain bubbles after bonding electronic devices and its a...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/00C09J4/06C09J7/00
Inventor 唐根初刘伟唐彬董绳财
Owner NANCHANG O FILM TECH CO LTD
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