Method for blocking adhesive in mixed pressing process of printed circuit board plate

A technology for circuit boards and board parts, which is applied in the field of glue resistance during the mixed pressure process of circuit board parts, and can solve problems such as residual glue flow on the surface of circuit board parts

Inactive Publication Date: 2013-10-23
PEKING UNIV FOUNDER GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to provide a method for resisting glue in the process of mixing and pressing circuit boar

Method used

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  • Method for blocking adhesive in mixed pressing process of printed circuit board plate
  • Method for blocking adhesive in mixed pressing process of printed circuit board plate
  • Method for blocking adhesive in mixed pressing process of printed circuit board plate

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Embodiment Construction

[0015] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. see Figure 4 The flowchart shown includes the following steps:

[0016] S11: making grooves for placing mixed pressure materials on the circuit board;

[0017] The circuit board components include a dielectric layer and a circuit board, and the dielectric layer is used for bonding two adjacent circuit boards. According to the thickness of the mixed-pressed material, grooves for placing the mixed-pressed material are processed on the corresponding layers of circuit boards or dielectric layers.

[0018] Mixed pressure materials include heat dissipation metals or components, etc.

[0019] S12: Fix the circuit boards of each layer together, and place the mixed pressure material in the groove;

[0020] Various layers of circuit boards can be fixed together by melting glue or riveting.

[0021] S13: Pressing after covering the surface ...

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Abstract

The invention provides a method for blocking an adhesive in the mixed pressing process of a printed circuit board plate. The method comprises the step of placing a flexible material, which covers a gap between a mixed pressing material and the circuit board plate, between a press plate and the surface of the circuit board plate containing the mixed pressing material. The flow adhesive can be prevented from overflowing from the gap in the laminating process through placing the flexible material in the laminating process. The surface of the laminated circuit board plate is smooth and flat, and the flow adhesive is filled in the gap uniformly, thereby effectively avoiding a problem that use of a circuit board is affected by the residual flow adhesive.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a method for resisting glue in the process of mixing and pressing circuit board components. Background technique [0002] see figure 1 , in the process of manufacturing the mixed pressure circuit board, the mixed pressure material 12 is placed in the groove of the circuit board plate 11 . see figure 2 A gap 13 is formed between the mixed pressure material 12 in the groove and the groove, and the gap 13 is filled with flow glue for bonding. [0003] The circuit board parts are pressed together under high temperature and vacuum state, and the mixed pressure material 12 and the circuit board part 11 are bonded together during the pressing process. [0004] see image 3 , during the pressing process, the flowing glue will overflow from the gap 13 under the pressure and vacuum state, and stick to the outer surface of the circuit board, image 3 The black area in is the residual ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 黄炳孟
Owner PEKING UNIV FOUNDER GRP CO LTD
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