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Socket structure

A socket and contact spring technology, applied in the field of socket structure, can solve the problems of not being able to fully meet miniaturization, low profile, etc., and achieve the effect of combining high water tightness

Inactive Publication Date: 2013-10-30
SMK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, when the audio socket connector of this patent document 1 is assembled on the target electronic device, although the advantage of being able to prevent moisture from penetrating into the device is obtained, it requires a corresponding size of assembly space, which cannot meet the needs of miniaturization and low cost. Backward requirements
The general socket is only slightly smaller than it, and it cannot meet the requirements of miniaturization and low profile.
As long as it has such a frame, even if it is miniaturized, there are problems such as the strength of the material, and it cannot be miniaturized infinitely.
Therefore, it is still unable to fully meet the requirements of miniaturization and low profile.

Method used

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Examples

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Embodiment Construction

[0035] Hereinafter, modes for implementing the invention will be described in detail based on examples and with reference to the drawings.

[0036] Such as figure 1 As shown in (a) to (f), the socket of the socket structure of the embodiment basically consists of a contact spring assembly 1 and a cover member 2 integrally mounted with the contact spring assembly 1 .

[0037] Such as figure 1 (a)~(f), image 3 (a)~(f), Figure 7 (a)~(f), Figure 8 (a), (b) and Figure 10As shown in (a) and (b), the above-mentioned contact spring assembly 1 is an assembly of the ring spring 1a, the second sleeve spring 1b, 1c, the first sleeve spring 1d and the leaf spring 1e. In this embodiment, the The above five contact springs are integrally mounted on the above-mentioned cover member 2 in the following positional relationship: in the state where the respective contact points 1a1, 1b1, 1c1, 1d1, and 1e1 are assembled on the frame of the installation target device 11, they can be connect...

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PUM

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Abstract

The invention provides a small socket structure with a low bracket beneficial for installing an object apparatus. When loading a contact spring component that forms the socket from a loading port (11b1) of loading ports (11b) for installation of the object apparatus, each contact part (1a1, 1b1, 1c1, 1d1, 1e1) of an annular spring, a second sleeve spring, a first sleeve spring and a sheet-type spring that form the contact spring component enters into a predetermined position inside a plug inserting hole (11a) that is formed on the object apparatus, and parts of their bases (1a2, 1b2, 1c2, 1d2, 1e2) are embedded in positions corresponding mounting grooves (11a1, 11a2, 11a3, 11a4, 11a5) around the plug inserting hole (11a), therefore roots (1a3, 1b3, 1c3, 1d3, 1e3) of the bases are installed on the main part of a cover component.

Description

technical field [0001] The present invention relates to a socket structure formed on the equipment side for transmitting and receiving audio signals, video signals, various control signals and other signals, or transmitting and receiving power for various portable communication equipment and other electronic equipment. Background technique [0002] In portable electronic devices such as mobile phones and other small electronic devices, further miniaturization, especially reduction in thickness is required, and therefore, of course, miniaturization of sockets, which are parts to be assembled in the device to be installed, is also required. [0003] Patent Document 1 relates to an audio socket connector, which includes: an insulating body, which is provided with an insertion hole for plug insertion opened on the front, and a plurality of terminal grooves communicating with the insertion hole are opened along both sides of the bottom wall; A plurality of terminals are arranged ...

Claims

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Application Information

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IPC IPC(8): H01R13/40H01R13/52
Inventor 樱田英将冈村智仁
Owner SMK CO LTD
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