Double-side scrubbing equipment between wafer production processes

Abstract

The invention discloses double-side scrubbing equipment between wafer production processes. A double-side scrubbing device in the double-side scrubbing equipment comprises a scrubbing support, a scrubbing mechanism and a first driving mechanism, wherein the scrubbing support is arranged on a rack; the scrubbing mechanism is provided with a plurality of pairs of synchronously rotating scrubbing shaft assemblies and hair brushes which are sleeved on the corresponding scrubbing shaft assemblies respectively; adjacent hair brushes are positioned on the two sides of a wafer to be scrubbed; the scrubbing shaft assemblies are rotatably supported on the scrubbing support; the first driving mechanism is used for driving the scrubbing shaft assemblies to rotate; each hair brush stretching mechanism corresponds to one pair of scrubbing shaft assemblies; each hair brush stretching mechanism comprises a rotating shaft, a swing arm and a swing cylinder; each swing cylinder is arranged on the rack through a swing cylinder fixing plate and is movably connected with the corresponding rotating shaft; each rotating shaft is rotatably supported on the scrubbing support; one end of each swing arm is fixedly connected to the corresponding rotating shaft, and the other end of the swing arm is fixedly connected to one of the corresponding pair of scrubbing shaft assemblies. According to the double-side scrubbing equipment, particulate pollutants produced in a wafer surface machining process can be synchronously scrubbed in a double-side manner; and a conventional manual scrubbing process is substituted.

Description

technical field [0001] The invention relates to double-sided scrubbing equipment between wafer production processes. Background technique [0002] Currently, in the wafer manufacturing process, it is well known that unnecessary residues left on the wafer surface by the manufacturing operations that have been performed must be cleaned. Examples of such fabrication operations include plasma etching and chemical mechanical polishing. If unwanted residues and particles are left on the surface of the wafer during successive manufacturing operations, these residues and particles can cause defects such as scratches on the wafer surface and improper interactions between metallization features. In some cases, such defects can cause devices on the wafer to become non-functional. To avoid the additional cost of discarding wafers with non-functioning devices, it is therefore imperative to properly and efficiently clean wafers after manufacturing operations that leave unwanted residues...

AI Technical Summary

Problems solved by technology

[0003] However, it is known that most of the wafer cleaning equipment after chemical mechanical polishing is a simple one-side scrubbing or manual brushing traditional process. The cleaning process is complicated, and the satisfactory cleanliness cannot be achieved and the efficiency is low. The remaining slurry can be seen along the edge of the wafer surface. and a large number of defects. In addition, the secondary pollution to the wafer is also very serious, and the automation rate and production capacity are not high. Therefore, the industry also needs a double-sided scrubbing equipment between wafer production processes to solve the above problems

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