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Micro-strip multi-directional power divider/combiner based on flexible connection

A technology of flexible connection and power divider, which is applied in the direction of connection devices, waveguide devices, electrical components, etc., can solve the problems of reducing loss and effectively dissipating heat, the output power cannot be achieved, and the structure is complicated to achieve. Effects of improved synthesis efficiency, improved synthesis efficiency, and good amplitude and phase consistency

Inactive Publication Date: 2015-04-01
CHINA ELECTRONIS TECH INSTR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microwave solid-state chips have the characteristics of small size, light weight, long service life, low working voltage, good stability, etc., but limited by the physical characteristics of semiconductors, heat dissipation, processing technology, impedance matching, etc. It does not meet the requirements of actual engineering, so it is necessary to use multiple single-chip amplifiers to adopt multi-channel power synthesis technology to improve the output power of the amplifier
[0003] The technical solutions adopted by the traditional planar circuit power distribution / combination and waveguide space power combination technology are relatively complex in terms of structure, and the problems of reducing loss and effective heat dissipation are also difficult to solve
At present, the structure of power combining technology at home and abroad can be roughly divided into two categories: planar power combining and space power combining, planar power combining adopts input and output in the same direction, multi-power The straight-through microstrip line of the device is too much and too long, and the loss also increases nonlinearly, and this structure occupies a large area, and the heat dissipation efficiency is low; the three-dimensional structure adopts the conversion and synthesis method of waveguide to microstrip, although it can solve the loss The problem of too large, but in the case of low frequency, the size of the waveguide port is large, which brings the overall structure too large and heavy, which brings inconvenience to the installation

Method used

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  • Micro-strip multi-directional power divider/combiner based on flexible connection
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  • Micro-strip multi-directional power divider/combiner based on flexible connection

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the present invention is not limited to these embodiments.

[0032] Such as figure 1 and figure 2 As shown, a microstrip multi-directional power distribution / combiner based on flexible connection includes a cavity and a microstrip, the cavity includes an upper cavity 1 and a lower cavity 13, and the upper cavity 1 is provided with The upper surface power distribution network, the lower surface power synthesis network is arranged in the lower cavity 13; the outer contours of the upper and lower cavities are regular decagonal, and the relative positions of the upper and lower cavities are respectively evenly distributed with The first through groove 2 and the second through groove 3 with the same structure, the first through groove 2 provides space for the connection between the power distribution network on the upper surface and th...

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Abstract

The invention discloses a micro-strip multi-directional power divider / combiner based on flexible connection. The micro-strip multi-directional power divider / combiner comprises a cavity and a micro strip. The cavity comprises an upper cavity body and a lower cavity body, an upper surface power dividing network is arranged in the upper cavity body, a lower surface power combining network is arranged in the lower cavity body. The upper surface power dividing network comprises an upper cavity circuit, and the lower surface power combining network comprises a lower cavity circuit. The micro strip comprises an upper cavity circuit input micro strip body, an upper cavity circuit output micro strip body, a lower cavity circuit input micro strip body and a lower cavity circuit output micro strip body. The upper cavity circuit comprises an upper cavity input connector, a 16-circuit power divider, a power amplifier chip and a Lange coupler, wherein the upper cavity input connector, the 16-circuit power divider, the power amplifier chip and the Lange coupler are sequentially connected. The lower cavity circuit comprises a lower cavity output connector and an 8-circuit power divider, wherein the lower cavity output connector is connected with the 8-circuit power divider. The upper cavity circuit is connected with the lower cavity circuit through a flexible cable. The micro-strip multi-directional power divider / combiner has a wider working band and higher power dividing / combining efficiency, and is small in size, large in heat dissipation area, low in machining accuracy and easy to assemble.

Description

technical field [0001] The invention relates to a power distribution / combiner, in particular to a microstrip multidirectional power distribution / combiner based on flexible connections. Background technique [0002] Microwave solid-state power amplifier is an important part of many millimeter-wave equipment such as: radar, guidance, radio astronomy, communication, remote sensing and other systems, and is an important subject of millimeter-wave technology research. Microwave solid-state chips have the characteristics of small size, light weight, long service life, low working voltage, good stability, etc., but limited by the physical characteristics of semiconductors, heat dissipation, processing technology, impedance matching, etc. It is less than the requirements of practical engineering, so it is necessary to use multiple single-chip amplifiers to adopt multi-channel power synthesis technology to improve the output power of the amplifier. [0003] The technical solutions a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/16
Inventor 袁振国姜万顺宁曰民
Owner CHINA ELECTRONIS TECH INSTR CO LTD
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