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Bending device and element installation device

The technology of a bending device and installation device, which is applied in the field of bending, can solve problems such as inappropriate contact between lead wires and bending devices, inability to reliably install lead wire components, and insufficient lead wire bending.

Active Publication Date: 2014-01-01
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As in the above-mentioned bending mechanism, in the structure in which the lead wire inserted into the insertion hole is brought into contact with the bending device (bending unit) provided for the insertion hole to bend the lead wire, when the positional relationship between the insertion hole and the bending device When it is inappropriate, sometimes the contact between the lead wire and the bending device is not proper and the bending of the lead wire is insufficient.
Insufficient bending of the leads may result in the lead components not being reliably mounted on the board

Method used

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  • Bending device and element installation device
  • Bending device and element installation device
  • Bending device and element installation device

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Embodiment Construction

[0016] figure 1 It is a plan view showing the schematic structure of the component mounting apparatus 1 according to the embodiment of the present invention, figure 2 is a partial front view of the component mounting device 1, image 3 It is a block diagram showing the main electrical configuration of the component mounting device 1 . The component mounting apparatus 1 shown in these figures has a structure capable of mounting both surface mount components and lead components P1 on the substrate S. In addition, in figure 1 , figure 2 In the drawings shown below, in order to clarify the directional relationship in each drawing, XYZ orthogonal coordinate axes with the Z-axis direction as the vertical direction are appropriately shown.

[0017] The component mounting apparatus 1 includes a base 11 and a substrate conveyance mechanism 2 provided on the base 11 , and can convey a substrate S in a predetermined conveyance direction X. More specifically, the substrate transfer...

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Abstract

The invention relates to a bending device and an element installation device. The bending device bends a lead of a lead element which is inserted into an insertion hole running from one main surface of a substrate to the other main surface of the substrate and comprises a lead receiving part and a base part. The lead receiving part is disposed on the other main surface side of the substrate and is contacted with the lead of the lead element, which is inserted in the insertion hole of the substrate in the element installation direction from one main surface of the substrate to the other main surface of the substrate, for bending the lead. The base part is used for supporting the lead receiving part. The lead receiving part is supported by the base part in such a manner that the lead receiving part is contacted with the lead and suffers the force from the lead and thus moves in a plane vertical to the element installation direction. Therefore, even the positional relation between the insertion hole of the substrate and the bending device are improper, the lead can be properly contacted with the bending device, the lead can be bent reliably and the lead element can be installed on the substrate reliably.

Description

technical field [0001] The present invention relates to a bending technique for mounting a lead component on a substrate by bending a lead of a lead component inserted into an insertion hole formed on a substrate. Background technique [0002] Japanese Laid-Open Publication No. Hei 06-112692 discloses a clinch mechanism that inserts the leads of lead components into mounting holes (insertion holes) formed on the substrate, and inserts the leads protruding from the substrate. The distal ends of the leads are bent, thereby mounting the lead elements on the substrate. This bending mechanism includes a head unit provided above the substrate and a bending unit provided below the substrate. When the head unit inserts the lead wire of the lead element into the mounting hole from above the substrate, the bending unit contacts the distal end of the lead protruding below the substrate. The bending unit is formed with a beveled inclined surface, and the distal end of the lead wire in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/00H05K13/02
Inventor 西城洋志野末智之
Owner YAMAHA MOTOR CO LTD
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