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Light emitting diode (LED) packages, systems, devices and related methods

A technology of LED packaging and light-emitting diodes, which is applied in the direction of semiconductor devices of light-emitting elements, lighting devices, light sources, etc.

Active Publication Date: 2014-01-22
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, leads typically do not have sufficient mass or exposed surface area to provide effective heat dissipation

Method used

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  • Light emitting diode (LED) packages, systems, devices and related methods
  • Light emitting diode (LED) packages, systems, devices and related methods
  • Light emitting diode (LED) packages, systems, devices and related methods

Examples

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Embodiment Construction

[0028] Reference will now be made in detail to possible aspects or implementations of the subject matter herein, one or more examples of which are illustrated in the accompanying drawings. Each example is provided to explain the subject matter, not as a limitation. In fact, features shown or described as part of one embodiment can be used on another embodiment to yield a still further embodiment. The subject matter disclosed and contemplated herein is intended to cover such modifications and changes.

[0029] As shown in the drawings, the size of some structures or portions are exaggerated relative to other structures or portions for illustrative purposes, and are thus provided to illustrate the general structure of the subject matter. Furthermore, aspects of the subject matter are described with reference to structures or portions formed on other structures, portions, or both. References to a structure or moiety being formed "on" or "over" another structure or moiety are in...

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Abstract

Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application Serial No. 61 / 482,088 filed May 3, 2011, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The subject matter disclosed herein relates generally to light emitting diode (LED) packages, and more particularly, to LED packages having a reflective body cavity with angled wall portions for receiving and reflecting light from an LED device. Background technique [0004] Solid state light sources, such as light emitting diodes (LEDs), are widely used in lighting products for commercial and personal use, including, for example, indoor and outdoor lighting applications and backlit displays for monitors and televisions. Incandescent bulbs and tubes and fluorescent bulbs and tubes have long been the standard specification in the lighting industry. Incandescent bulbs and tubes and fluorescent bulbs and tubes m...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/62
CPCH01L33/486H01L33/60H01L2224/48091H01L2224/48247F21K9/27F21K9/66F21V3/10F21Y2105/10F21Y2115/10H01L2924/00014
Inventor 朱晟喆克勒斯托弗·P·胡赛尔
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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