Circuit laminate structure

Abstract

A circuit laminate structure, comprising a first circuit layer, a first insulating layer, at least one second circuit layer, at least one second insulating layer, and a supporting frame, the total thickness of the circuit laminate structure is less than 150 μm, wherein the supporting frame is arranged on the edge of the surface of the first insulating layer and the first circuit layer, and does not cover the part of the first circuit layer exposed to the outside world, it is made of at least one metal material, by The support frame is arranged on the edge of the coplanar surface of the first insulating layer and the first circuit layer, and physically supports the circuit laminate without affecting the circuit connection, so as to avoid subsequent problems such as bending of the thin plate.

Description

technical field [0001] The invention relates to a circuit laminate structure. The support frame is mainly made in the vacant area to maintain the stability of the overall structure. Background technique [0002] refer to figure 1 , is a schematic cross-sectional view of a circuit structure of a circuit laminate in the prior art. The circuit structure 500 of the prior art circuit laminate includes a first circuit layer 21 , a first insulating layer 31 , at least one second circuit layer 25 , at least one second insulating layer 33 , and a solder resist layer 50 . [0003] The first insulating layer 31 is disposed on the first wiring layer 21, covers the upper surface of the first wiring layer 21, and forms a coplanar surface with the lower surface of the first wiring layer 21, and on the coplanar surface, Part of the first circuit layer 21 is exposed to the outside. The innermost one of the at least one second circuit layer 25 is disposed on the first insulating layer 31, ...

AI Technical Summary

Problems solved by technology

[0005] The problem with the existing technology is that in order to match lighter, thinner and shorter electronic products, the thickness of circuit laminates must become thinner and thinner. However, in the current thin plate structure, subsequent chip connections, packaging, and operations may be due to circuit laminates. Thinning of the board inevitably produces bending, which may cause various problems of peeling, short circuit or failure of the circuit or laminate on it

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